HiSilicon Kirin 9000 5G vs Unisoc Tanggula T770 5G

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The HiSilicon Kirin 9000 5G and Unisoc Tanggula T770 5G are two processors that offer high-performance capabilities in the mobile device market.

Starting with the HiSilicon Kirin 9000 5G, it features a powerful CPU architecture with a three-tiered design. It consists of 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This architecture allows for efficient multitasking and smooth performance across various applications. Additionally, it utilizes the advanced ARMv8.2-A instruction set.

The Kirin 9000 5G is manufactured using a cutting-edge 5 nm lithography process. This ensures high energy efficiency, leading to improved battery life in mobile devices. With a staggering 15,300 million transistors, this processor offers exceptional processing power for demanding tasks. Moreover, it has a relatively low thermal design power (TDP) of 6 Watts, contributing to its energy-saving capabilities.

In terms of neural processing, the Kirin 9000 5G incorporates the Ascend Lite and Ascend Tiny technologies. These neural processing units (NPU) enhance artificial intelligence (AI) capabilities, enabling advanced features like facial recognition and AI photography. The processor also adopts the HUAWEI Da Vinci Architecture 2.0, further optimizing AI performance.

On the other hand, the Unisoc Tanggula T770 5G features a competitive set of specifications as well. Its CPU architecture consists of 1x 2.5 GHz Cortex-A76 core, 3x 2.2 GHz Cortex-A76 cores, and 4x 2.0 GHz Cortex-A55 cores. While slightly lower in clock speed compared to the Kirin 9000 5G, it still provides solid performance for various tasks.

The Tanggula T770 5G adopts the ARMv8.2-A instruction set, ensuring compatibility with the latest software. Manufactured with a 6 nm lithography process, this processor offers good energy efficiency. It has a TDP of 5 Watts, indicating a lower power consumption compared to the Kirin 9000 5G.

In terms of neural processing, the Tanggula T770 5G features an NPU for AI-related tasks. While not as advanced as the Kirin 9000 5G's Ascend Lite and Ascend Tiny technologies, it still enables AI capabilities for enhanced user experiences.

In conclusion, both the HiSilicon Kirin 9000 5G and Unisoc Tanggula T770 5G offer competitive specifications. The Kirin 9000 5G stands out with its powerful CPU architecture, advanced neural processing technologies, and a more advanced lithography process. However, the Tanggula T770 5G provides solid performance and energy efficiency at a slightly lower clock speed and lower TDP. The choice between these processors would depend on specific requirements and the intended usage of the device in which they are being used.

CPU cores and architecture

Architecture	1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55	1x 2.5 GHz – Cortex-A76 3x 2.2 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55
Number of cores	8	8
Instruction Set	ARMv8.2-A	ARMv8.2-A
Lithography	5 nm	6 nm
Number of transistors	15300 million
TDP	6 Watt	5 Watt
Neural Processing	Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0	NPU

Memory (RAM)

Max amount	up to 16 GB	up to 32 GB
Memory type	LPDDR5	LPDDR4X
Memory frequency	2750 MHz	2133 MHz
Memory-bus	4x16 bit	4x16 bit

Storage

Storage specification

UFS 3.1

Graphics

GPU name	Mali-G78 MP24	Mali-G57 MP6
GPU Architecture	Valhall	Valhall
GPU frequency	760 MHz	850 MHz
Execution units	24	6
Shaders	384	96
DirectX	12	12
OpenCL API	2.1	2.1
OpenGL API	ES 3.2	ES 3.2
Vulkan API	1.2	1.2

Camera, Video, Display

Max screen resolution	3840x2160	2160x1080@120Hz
Max camera resolution		1x 108MP, 2x 24MP
Max Video Capture	4K@60fps	FullHD@30fps
Video codec support	H.264 (AVC) H.265 (HEVC) VP8 VP9	H.264 (AVC) H.265 (HEVC)

Wireless

4G network	Yes	Yes
5G network	Yes	Yes
Peak Download Speed	4.6 Gbps	2.7 Gbps
Peak Upload Speed	2.5 Gbps	1.5 Gbps
Wi-Fi	6 (802.11ax)	5 (802.11ac)
Bluetooth	5.2	5.0
Satellite navigation	BeiDou GPS Galileo GLONASS NavIC	BeiDou GPS Galileo GLONASS