HiSilicon Kirin 9000 5G vs Unisoc SC9863A

The HiSilicon Kirin 9000 5G and Unisoc SC9863A are two processors with distinct specifications. Let's compare them based on their CPU cores and architecture, instruction set, lithography, TDP (Thermal Design Power), and neural processing capabilities.

Starting with the HiSilicon Kirin 9000 5G, it features a total of 8 CPU cores divided into three categories: 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55. The architecture utilized is ARMv8.2-A, and it employs a 5 nm lithography. With 15300 million transistors, this processor operates at a TDP of 6 Watts. In terms of neural processing, it incorporates Ascend Lite (2x) + Ascend Tiny (1x) with the HUAWEI Da Vinci Architecture 2.0.

On the other hand, the Unisoc SC9863A is equipped with a configuration of 8 CPU cores as well. It consists of 4x 1.6 GHz Cortex-A55 and 4x 1.2 GHz Cortex-A55 cores. Similar to the Kirin 9000 5G, it utilizes the ARMv8.2-A instruction set. However, the lithography of this processor is 28 nm, which is notably higher than that of the Kirin 9000 5G. With a TDP of 3 Watts, it incorporates an NPU for neural processing.

In summary, while both processors possess 8 cores and follow the ARMv8.2-A instruction set, there are significant differences in their specifications. The HiSilicon Kirin 9000 5G employs a more advanced 5 nm lithography, which may contribute to better power efficiency. Additionally, it incorporates Ascend Lite and Ascend Tiny neural processors with the HUAWEI Da Vinci Architecture 2.0. On the other hand, the Unisoc SC9863A operates on a 28 nm lithography and features an NPU for neural processing. These differences in specifications may result in variations in performance, power consumption, and overall efficiency.

CPU cores and architecture

Architecture 1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
4x 1.6 GHz – Cortex-A55
4x 1.2 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 5 nm 28 nm
Number of transistors 15300 million
TDP 6 Watt 3 Watt
Neural Processing Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 NPU

Memory (RAM)

Max amount up to 16 GB up to 4 GB
Memory type LPDDR5 LPDDR4X
Memory frequency 2750 MHz 1866 MHz
Memory-bus 4x16 bit 2x16 bit


Storage specification UFS 3.1 eMMC 5.1


GPU name Mali-G78 MP24 Imagination PowerVR GE8322
GPU Architecture Valhall Rogue
GPU frequency 760 MHz 550 MHz
Execution units 24 4
Shaders 384 128
DirectX 12 11
OpenCL API 2.1 3.0
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 3840x2160 2160x1080
Max camera resolution 1x 16MP + 1x 5MP
Max Video Capture 4K@60fps FullHD@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
H.264 (AVC)
H.265 (HEVC)


4G network Yes Yes
5G network Yes Yes
Peak Download Speed 4.6 Gbps 0.3 Gbps
Peak Upload Speed 2.5 Gbps 0.1 Gbps
Wi-Fi 6 (802.11ax) 4 (802.11n)
Bluetooth 5.2 4.2
Satellite navigation BeiDou

Supplemental Information

Launch Date 2020 October 2018 November
Partnumber SC9863A
Vertical Segment Mobiles Mobiles
Positioning Flagship Low-end

AnTuTu 10

Total Score
Kirin 9000 5G

GeekBench 6 Single-Core

Kirin 9000 5G

GeekBench 6 Multi-Core

Kirin 9000 5G