HiSilicon Kirin 9000 5G vs Unisoc SC7731E
The HiSilicon Kirin 9000 5G and Unisoc SC7731E are two processors with distinct specifications.
Starting with the HiSilicon Kirin 9000 5G, this processor boasts an impressive architecture. It consists of 8 cores, including 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55 cores. Furthermore, it utilizes the ARMv8.2-A instruction set. With a lithography of 5nm, the Kirin 9000 5G is built using advanced fabrication technology. It is equipped with an impressive 15300 million transistors, allowing for efficient processing power. This processor has a TDP (Thermal Design Power) of 6 Watts, indicating its energy efficiency. Additionally, it incorporates Ascend Lite (2x) + Ascend Tiny (1x) neural processing technology, alongside HUAWEI Da Vinci Architecture 2.0.
On the other hand, the Unisoc SC7731E offers different specifications. Its architecture consists of 4x 1.3 GHz Cortex-A7 cores. The number of cores is capped at 4, providing a slightly lower level of multitasking capability compared to the Kirin 9000 5G. The SC7731E utilizes the ARMv7-A instruction set and has a lithography of 28nm, which is less advanced compared to the Kirin 9000 5G. The TDP of the SC7731E is slightly higher, at 7 Watts.
In summary, the HiSilicon Kirin 9000 5G and Unisoc SC7731E processors differ significantly in their specifications. The Kirin 9000 5G offers a more advanced architecture with a greater number of cores and higher clock speeds. It also benefits from the ARMv8.2-A instruction set and a more advanced 5nm lithography. Additionally, its neural processing capabilities, Ascend Lite, Ascend Tiny, and HUAWEI Da Vinci Architecture 2.0, make it suitable for demanding tasks. On the other hand, the Unisoc SC7731E is a more modest processor with a simpler architecture, fewer cores, and a lower clock speed. While it may not offer the same level of performance as the Kirin 9000 5G, it can still handle basic tasks efficiently.
Starting with the HiSilicon Kirin 9000 5G, this processor boasts an impressive architecture. It consists of 8 cores, including 1x 3.13 GHz Cortex-A77, 3x 2.54 GHz Cortex-A77, and 4x 2.05 GHz Cortex-A55 cores. Furthermore, it utilizes the ARMv8.2-A instruction set. With a lithography of 5nm, the Kirin 9000 5G is built using advanced fabrication technology. It is equipped with an impressive 15300 million transistors, allowing for efficient processing power. This processor has a TDP (Thermal Design Power) of 6 Watts, indicating its energy efficiency. Additionally, it incorporates Ascend Lite (2x) + Ascend Tiny (1x) neural processing technology, alongside HUAWEI Da Vinci Architecture 2.0.
On the other hand, the Unisoc SC7731E offers different specifications. Its architecture consists of 4x 1.3 GHz Cortex-A7 cores. The number of cores is capped at 4, providing a slightly lower level of multitasking capability compared to the Kirin 9000 5G. The SC7731E utilizes the ARMv7-A instruction set and has a lithography of 28nm, which is less advanced compared to the Kirin 9000 5G. The TDP of the SC7731E is slightly higher, at 7 Watts.
In summary, the HiSilicon Kirin 9000 5G and Unisoc SC7731E processors differ significantly in their specifications. The Kirin 9000 5G offers a more advanced architecture with a greater number of cores and higher clock speeds. It also benefits from the ARMv8.2-A instruction set and a more advanced 5nm lithography. Additionally, its neural processing capabilities, Ascend Lite, Ascend Tiny, and HUAWEI Da Vinci Architecture 2.0, make it suitable for demanding tasks. On the other hand, the Unisoc SC7731E is a more modest processor with a simpler architecture, fewer cores, and a lower clock speed. While it may not offer the same level of performance as the Kirin 9000 5G, it can still handle basic tasks efficiently.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
4x 1.3 GHz – Cortex-A7 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8.2-A | ARMv7-A |
Lithography | 5 nm | 28 nm |
Number of transistors | 15300 million | |
TDP | 6 Watt | 7 Watt |
Neural Processing | Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 |
Memory (RAM)
Max amount | up to 16 GB | up to 1 GB |
Memory type | LPDDR5 | LPDDR3 |
Memory frequency | 2750 MHz | 533 MHz |
Memory-bus | 4x16 bit |
Storage
Storage specification | UFS 3.1 | eMMC 5.1 |
Graphics
GPU name | Mali-G78 MP24 | Mali-T820 MP1 |
GPU Architecture | Mali Valhall | Mali Midgard |
GPU frequency | 760 MHz | 600 MHz |
Execution units | 24 | 1 |
Shaders | 384 | 4 |
DirectX | 12 | 11 |
OpenCL API | 2.1 | 1.2 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.0 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 1440x720 |
Max camera resolution | 1x 8MP | |
Max Video Capture | 4K@60fps | HD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | |
Peak Upload Speed | 2.5 Gbps | |
Wi-Fi | 6 (802.11ax) | 4 (802.11n) |
Bluetooth | 5.2 | 4.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS GLONASS |
Supplemental Information
Launch Date | 2020 October | 2018 Quarter 2 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Low-end |
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