HiSilicon Kirin 9000 5G vs MediaTek Dimensity 930

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The HiSilicon Kirin 9000 5G and MediaTek Dimensity 930 are both powerful processors with their own unique specifications. Let's compare them side by side.

Starting with the HiSilicon Kirin 9000 5G, it features an advanced architecture consisting of a combination of CPU cores. It has 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This processor has a total of 8 cores, offering a versatile and efficient performance. It adopts the ARMv8.2-A instruction set and is built on a cutting-edge 5 nm lithography process. With approximately 15.3 billion transistors, this processor packs a significant amount of computing power. It has a TDP (Thermal Design Power) of 6 Watts, ensuring a balance between performance and power consumption. Additionally, the HiSilicon Kirin 9000 5G boasts a neural processing capability with Ascend Lite (2x) + Ascend Tiny (1x), and HUAWEI Da Vinci Architecture 2.0.

On the other hand, the MediaTek Dimensity 930 also offers a powerful performance. It features an architecture with 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Just like the Kirin 9000, it has a total of 8 cores, delivering a capable and efficient performance. The Dimensity 930 uses the ARMv8.2-A instruction set and is based on a 6 nm lithography process. With a TDP of 10 Watts, it consumes slightly more power than the Kirin 9000. However, it compensates with its dedicated Neural Processing Unit (NPU), showcasing MediaTek's focus on artificial intelligence processing.

In conclusion, both the HiSilicon Kirin 9000 5G and MediaTek Dimensity 930 processors offer impressive specifications. The Kirin 9000 shines with its diverse and powerful CPU cores, while the Dimensity 930 stands out with its dedicated NPU for AI processing. It's important to consider your specific requirements and preferences when choosing between these processors, as they excel in different areas.

CPU cores and architecture

Architecture 1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
2x 2.2 GHz – Cortex-A78
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 5 nm 6 nm
Number of transistors 15300 million
TDP 6 Watt 10 Watt
Neural Processing Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 NPU

Memory (RAM)

Max amount up to 16 GB up to 16 GB
Memory type LPDDR5 LPDDR5
Memory frequency 2750 MHz 3200 MHz
Memory-bus 4x16 bit 4x16 bit

Storage

Storage specification UFS 3.1 UFS 3.1

Graphics

GPU name Mali-G78 MP24 Imagination PowerVR BXM-8-256
GPU Architecture Valhall Rogue
GPU frequency 760 MHz 800 MHz
Execution units 24
Shaders 384
DirectX 12 12
OpenCL API 2.1 3.0
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 3840x2160 2520x1080@120Hz
Max camera resolution 1x 108MP, 1x 64MP
Max Video Capture 4K@60fps 2K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 4.6 Gbps 2.77 Gbps
Peak Upload Speed 2.5 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.2 5.2
Satellite navigation BeiDou
GPS
Galileo
GLONASS
NavIC
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2020 October 2022 Quarter 3
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 9000 5G
762886
Dimensity 930

GeekBench 6 Single-Core

Score
Kirin 9000 5G
1062
Dimensity 930

GeekBench 6 Multi-Core

Score
Kirin 9000 5G
3724
Dimensity 930