HiSilicon Kirin 9000 5G vs MediaTek Dimensity 930
The HiSilicon Kirin 9000 5G and MediaTek Dimensity 930 are both powerful processors with their own unique specifications. Let's compare them side by side.
Starting with the HiSilicon Kirin 9000 5G, it features an advanced architecture consisting of a combination of CPU cores. It has 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This processor has a total of 8 cores, offering a versatile and efficient performance. It adopts the ARMv8.2-A instruction set and is built on a cutting-edge 5 nm lithography process. With approximately 15.3 billion transistors, this processor packs a significant amount of computing power. It has a TDP (Thermal Design Power) of 6 Watts, ensuring a balance between performance and power consumption. Additionally, the HiSilicon Kirin 9000 5G boasts a neural processing capability with Ascend Lite (2x) + Ascend Tiny (1x), and HUAWEI Da Vinci Architecture 2.0.
On the other hand, the MediaTek Dimensity 930 also offers a powerful performance. It features an architecture with 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Just like the Kirin 9000, it has a total of 8 cores, delivering a capable and efficient performance. The Dimensity 930 uses the ARMv8.2-A instruction set and is based on a 6 nm lithography process. With a TDP of 10 Watts, it consumes slightly more power than the Kirin 9000. However, it compensates with its dedicated Neural Processing Unit (NPU), showcasing MediaTek's focus on artificial intelligence processing.
In conclusion, both the HiSilicon Kirin 9000 5G and MediaTek Dimensity 930 processors offer impressive specifications. The Kirin 9000 shines with its diverse and powerful CPU cores, while the Dimensity 930 stands out with its dedicated NPU for AI processing. It's important to consider your specific requirements and preferences when choosing between these processors, as they excel in different areas.
Starting with the HiSilicon Kirin 9000 5G, it features an advanced architecture consisting of a combination of CPU cores. It has 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. This processor has a total of 8 cores, offering a versatile and efficient performance. It adopts the ARMv8.2-A instruction set and is built on a cutting-edge 5 nm lithography process. With approximately 15.3 billion transistors, this processor packs a significant amount of computing power. It has a TDP (Thermal Design Power) of 6 Watts, ensuring a balance between performance and power consumption. Additionally, the HiSilicon Kirin 9000 5G boasts a neural processing capability with Ascend Lite (2x) + Ascend Tiny (1x), and HUAWEI Da Vinci Architecture 2.0.
On the other hand, the MediaTek Dimensity 930 also offers a powerful performance. It features an architecture with 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. Just like the Kirin 9000, it has a total of 8 cores, delivering a capable and efficient performance. The Dimensity 930 uses the ARMv8.2-A instruction set and is based on a 6 nm lithography process. With a TDP of 10 Watts, it consumes slightly more power than the Kirin 9000. However, it compensates with its dedicated Neural Processing Unit (NPU), showcasing MediaTek's focus on artificial intelligence processing.
In conclusion, both the HiSilicon Kirin 9000 5G and MediaTek Dimensity 930 processors offer impressive specifications. The Kirin 9000 shines with its diverse and powerful CPU cores, while the Dimensity 930 stands out with its dedicated NPU for AI processing. It's important to consider your specific requirements and preferences when choosing between these processors, as they excel in different areas.
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
2x 2.2 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 5 nm | 6 nm |
Number of transistors | 15300 million | |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 | NPU |
Memory (RAM)
Max amount | up to 16 GB | up to 16 GB |
Memory type | LPDDR5 | LPDDR5 |
Memory frequency | 2750 MHz | 3200 MHz |
Memory-bus | 4x16 bit | 4x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 3.1 |
Graphics
GPU name | Mali-G78 MP24 | Imagination PowerVR BXM-8-256 |
GPU Architecture | Valhall | Rogue |
GPU frequency | 760 MHz | 800 MHz |
Execution units | 24 | |
Shaders | 384 | |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 3.0 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 2520x1080@120Hz |
Max camera resolution | 1x 108MP, 1x 64MP | |
Max Video Capture | 4K@60fps | 2K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 2.5 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.2 | 5.2 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2020 October | 2022 Quarter 3 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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