HiSilicon Kirin 9000 5G vs MediaTek Dimensity 900

The HiSilicon Kirin 9000 5G and MediaTek Dimensity 900 are two powerful processors with impressive specifications. Let's compare them based on their specifications to see how they stack up against each other.

Starting with the CPU cores and architecture, the HiSilicon Kirin 9000 5G boasts an architecture of 1x 3.13 GHz – Cortex-A77, 3x 2.54 GHz – Cortex-A77, and 4x 2.05 GHz – Cortex-A55. On the other hand, the MediaTek Dimensity 900 features an architecture of 2x 2.4 GHz – Cortex-A78 and 6x 2.0 GHz – Cortex-A55. Both processors have 8 cores and support the ARMv8.2-A instruction set.

Moving on to the lithography, the HiSilicon Kirin 9000 5G has a smaller lithography of 5 nm compared to the MediaTek Dimensity 900's 6 nm. A smaller lithography generally results in better power efficiency and performance.

When it comes to the number of transistors, the HiSilicon Kirin 9000 5G takes the lead with 15300 million transistors, while the MediaTek Dimensity 900 has 10000 million transistors. This indicates that the HiSilicon Kirin 9000 5G may have a slight advantage in terms of processing power and efficiency.

In terms of thermal design power (TDP), the HiSilicon Kirin 9000 5G consumes less power at 6 Watts, compared to the MediaTek Dimensity 900's 10 Watts. This means that the HiSilicon Kirin 9000 5G may offer better battery life and less heat generation.

Lastly, both processors feature neural processing units (NPUs) for AI tasks. The HiSilicon Kirin 9000 5G incorporates the Ascend Lite (2x) + Ascend Tiny (1x) with HUAWEI Da Vinci Architecture 2.0, while the MediaTek Dimensity 900 has its own NPU. Further details about their AI capabilities are not provided in the specifications.

In summary, the HiSilicon Kirin 9000 5G appears to have a slight advantage over the MediaTek Dimensity 900 in terms of architecture, lithography, number of transistors, TDP, and neural processing. However, it is important to note that real-world performance can vary based on several factors, including software optimization and overall device design.

CPU cores and architecture

Architecture 1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
2x 2.4 GHz – Cortex-A78
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 5 nm 6 nm
Number of transistors 15300 million 10000 million
TDP 6 Watt 10 Watt
Neural Processing Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 NPU

Memory (RAM)

Max amount up to 16 GB up to 16 GB
Memory type LPDDR5 LPDDR5
Memory frequency 2750 MHz 3200 MHz
Memory-bus 4x16 bit 4x16 bit


Storage specification UFS 3.1 UFS 3.1


GPU name Mali-G78 MP24 Mali-G68 MP4
GPU Architecture Valhall Valhall
GPU frequency 760 MHz 900 MHz
Execution units 24 4
Shaders 384 64
DirectX 12 12
OpenCL API 2.1 2.0
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 3840x2160 2520x1080@120Hz
Max camera resolution 1x 108MP, 2x 20MP
Max Video Capture 4K@60fps 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
H.264 (AVC)
H.265 (HEVC)


4G network Yes Yes
5G network Yes Yes
Peak Download Speed 4.6 Gbps 2.77 Gbps
Peak Upload Speed 2.5 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 6 (802.11ax)
Bluetooth 5.2 5.2
Satellite navigation BeiDou

Supplemental Information

Launch Date 2020 October 2021 Quarter 1
Partnumber MT6877
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 9000 5G
Dimensity 900

GeekBench 6 Single-Core

Kirin 9000 5G
Dimensity 900

GeekBench 6 Multi-Core

Kirin 9000 5G
Dimensity 900