HiSilicon Kirin 9000 5G vs MediaTek Dimensity 820

The HiSilicon Kirin 9000 5G and MediaTek Dimensity 820 are both high-performance processors, but they differ in several specifications. The Kirin 9000 5G has a more advanced architecture, with one Cortex-A77 core clocked at 3.13 GHz, three Cortex-A77 cores clocked at 2.54 GHz, and four Cortex-A55 cores clocked at 2.05 GHz. In contrast, the Dimensity 820 features four Cortex-A76 cores clocked at 2.6 GHz and four Cortex-A55 cores clocked at 2.0 GHz.

Both processors utilize the ARMv8.2-A instruction set, ensuring compatibility with the latest software and applications. The Kirin 9000 5G is manufactured using a more advanced 5 nm lithography process, which allows for more transistors to be packed into the chip. It boasts a staggering 15,300 million transistors, enhancing overall performance and power efficiency. On the other hand, the Dimensity 820 is built using a slightly less advanced 7 nm lithography process.

In terms of power consumption, the Kirin 9000 5G has a TDP (Thermal Design Power) of 6 Watts, making it more energy-efficient than the Dimensity 820, which has a TDP of 10 Watts. This could result in longer battery life for devices powered by the Kirin processor.

When it comes to neural processing capabilities, the Kirin 9000 5G features two Ascend Lite NPUs and one Ascend Tiny NPU. These Neural Processing Units, along with Huawei's Da Vinci Architecture 2.0, significantly enhance AI performance. On the other hand, the Dimensity 820 includes an NPU to handle AI computations. Though it may not be as advanced as the Kirin's NPUs, it still offers efficient AI processing.

In conclusion, the HiSilicon Kirin 9000 5G outperforms the MediaTek Dimensity 820 in terms of architecture, lithography, transistor count, and power efficiency. However, the Dimensity 820 still offers competitive performance and AI capabilities. Ultimately, the choice between these processors depends on specific requirements and the intended usage of the device they power.

CPU cores and architecture

Architecture 1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
4x 2.6 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 5 nm 7 nm
Number of transistors 15300 million
TDP 6 Watt 10 Watt
Neural Processing Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 NPU

Memory (RAM)

Max amount up to 16 GB up to 16 GB
Memory type LPDDR5 LPDDR4X
Memory frequency 2750 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit


Storage specification UFS 3.1 UFS 2.2


GPU name Mali-G78 MP24 Mali-G57 MP5
GPU Architecture Valhall Valhall
GPU frequency 760 MHz 650 MHz
Execution units 24 5
Shaders 384 80
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 3840x2160 2520x1080@120Hz
Max camera resolution 1x 80MP, 1x 32MP + 1x 16MP
Max Video Capture 4K@60fps 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
H.264 (AVC)
H.265 (HEVC)


4G network Yes Yes
5G network Yes Yes
Peak Download Speed 4.6 Gbps 2.77 Gbps
Peak Upload Speed 2.5 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.2 5.1
Satellite navigation BeiDou

Supplemental Information

Launch Date 2020 October 2020 May
Partnumber MT6875
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 9000 5G
Dimensity 820

GeekBench 6 Single-Core

Kirin 9000 5G
Dimensity 820

GeekBench 6 Multi-Core

Kirin 9000 5G
Dimensity 820