HiSilicon Kirin 9000 5G vs MediaTek Dimensity 720
When comparing the HiSilicon Kirin 9000 5G and MediaTek Dimensity 720 processors, several differences can be observed in their specifications.
Starting with the CPU cores and architecture, the HiSilicon Kirin 9000 5G features a more powerful configuration. It includes 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. On the other hand, the MediaTek Dimensity 720 has 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. While both processors have 8 cores, the Kirin 9000 5G offers a higher clock speed and utilizes a more diverse range of core designs.
In terms of instruction set, both processors follow the ARMv8.2-A architecture. This ensures compatibility with the latest software and applications. However, it is worth noting that the HiSilicon Kirin 9000 5G implements a more advanced neural processing system. It includes Ascend Lite (2x) and Ascend Tiny (1x), utilizing the HUAWEI Da Vinci Architecture 2.0. On the other hand, the MediaTek Dimensity 720 has a Neural Processing Unit (NPU), which provides AI capabilities but may not be as comprehensive as the Ascend Lite and Ascend Tiny combination.
Regarding lithography, the HiSilicon Kirin 9000 5G benefits from a more advanced 5 nm process. This allows for higher transistor density and improved power efficiency. In contrast, the MediaTek Dimensity 720 utilizes a 7 nm lithography. While still efficient, it may not reach the same level as the Kirin 9000 5G in terms of power consumption.
Lastly, the thermal design power (TDP) varies between the processors. The HiSilicon Kirin 9000 5G has a TDP of 6 Watts, indicating lower heat generation under load. The MediaTek Dimensity 720, on the other hand, has a TDP of 10 Watts. This suggests that the Kirin 9000 5G may offer superior thermal performance.
In summary, the HiSilicon Kirin 9000 5G stands out with its more advanced CPU architecture, higher clock speeds, comprehensive neural processing system, and enhanced power efficiency due to its 5 nm lithography and lower TDP. The MediaTek Dimensity 720, while still capable, may not offer the same level of performance and efficiency as the Kirin 9000 5G in these areas.
Starting with the CPU cores and architecture, the HiSilicon Kirin 9000 5G features a more powerful configuration. It includes 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. On the other hand, the MediaTek Dimensity 720 has 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. While both processors have 8 cores, the Kirin 9000 5G offers a higher clock speed and utilizes a more diverse range of core designs.
In terms of instruction set, both processors follow the ARMv8.2-A architecture. This ensures compatibility with the latest software and applications. However, it is worth noting that the HiSilicon Kirin 9000 5G implements a more advanced neural processing system. It includes Ascend Lite (2x) and Ascend Tiny (1x), utilizing the HUAWEI Da Vinci Architecture 2.0. On the other hand, the MediaTek Dimensity 720 has a Neural Processing Unit (NPU), which provides AI capabilities but may not be as comprehensive as the Ascend Lite and Ascend Tiny combination.
Regarding lithography, the HiSilicon Kirin 9000 5G benefits from a more advanced 5 nm process. This allows for higher transistor density and improved power efficiency. In contrast, the MediaTek Dimensity 720 utilizes a 7 nm lithography. While still efficient, it may not reach the same level as the Kirin 9000 5G in terms of power consumption.
Lastly, the thermal design power (TDP) varies between the processors. The HiSilicon Kirin 9000 5G has a TDP of 6 Watts, indicating lower heat generation under load. The MediaTek Dimensity 720, on the other hand, has a TDP of 10 Watts. This suggests that the Kirin 9000 5G may offer superior thermal performance.
In summary, the HiSilicon Kirin 9000 5G stands out with its more advanced CPU architecture, higher clock speeds, comprehensive neural processing system, and enhanced power efficiency due to its 5 nm lithography and lower TDP. The MediaTek Dimensity 720, while still capable, may not offer the same level of performance and efficiency as the Kirin 9000 5G in these areas.
CPU cores and architecture
Architecture | 1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8.2-A | ARMv8.2-A |
Lithography | 5 nm | 7 nm |
Number of transistors | 15300 million | |
TDP | 6 Watt | 10 Watt |
Neural Processing | Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 | NPU |
Memory (RAM)
Max amount | up to 16 GB | up to 12 GB |
Memory type | LPDDR5 | LPDDR4X |
Memory frequency | 2750 MHz | 2133 MHz |
Memory-bus | 4x16 bit | 2x16 bit |
Storage
Storage specification | UFS 3.1 | UFS 2.2 |
Graphics
GPU name | Mali-G78 MP24 | Mali-G57 MP3 |
GPU Architecture | Valhall | Valhall |
GPU frequency | 760 MHz | 850 MHz |
Execution units | 24 | 3 |
Shaders | 384 | |
DirectX | 12 | 12 |
OpenCL API | 2.1 | 2.1 |
OpenGL API | ES 3.2 | ES 3.2 |
Vulkan API | 1.2 | 1.2 |
Camera, Video, Display
Max screen resolution | 3840x2160 | 2520x1080@90Hz |
Max camera resolution | 1x 64MP, 1x 20MP + 1x 16MP | |
Max Video Capture | 4K@60fps | 4K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 4.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 2.5 Gbps | 1.2 Gbps |
Wi-Fi | 6 (802.11ax) | 5 (802.11ac) |
Bluetooth | 5.2 | 5.1 |
Satellite navigation | BeiDou GPS Galileo GLONASS NavIC |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2020 October | 2020 Quarter 3 |
Partnumber | MT6853V/ZA, MT6853V/NZA | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Flagship | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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