HiSilicon Kirin 9000 5G vs MediaTek Dimensity 720

VS
When comparing the HiSilicon Kirin 9000 5G and MediaTek Dimensity 720 processors, several differences can be observed in their specifications.

Starting with the CPU cores and architecture, the HiSilicon Kirin 9000 5G features a more powerful configuration. It includes 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. On the other hand, the MediaTek Dimensity 720 has 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. While both processors have 8 cores, the Kirin 9000 5G offers a higher clock speed and utilizes a more diverse range of core designs.

In terms of instruction set, both processors follow the ARMv8.2-A architecture. This ensures compatibility with the latest software and applications. However, it is worth noting that the HiSilicon Kirin 9000 5G implements a more advanced neural processing system. It includes Ascend Lite (2x) and Ascend Tiny (1x), utilizing the HUAWEI Da Vinci Architecture 2.0. On the other hand, the MediaTek Dimensity 720 has a Neural Processing Unit (NPU), which provides AI capabilities but may not be as comprehensive as the Ascend Lite and Ascend Tiny combination.

Regarding lithography, the HiSilicon Kirin 9000 5G benefits from a more advanced 5 nm process. This allows for higher transistor density and improved power efficiency. In contrast, the MediaTek Dimensity 720 utilizes a 7 nm lithography. While still efficient, it may not reach the same level as the Kirin 9000 5G in terms of power consumption.

Lastly, the thermal design power (TDP) varies between the processors. The HiSilicon Kirin 9000 5G has a TDP of 6 Watts, indicating lower heat generation under load. The MediaTek Dimensity 720, on the other hand, has a TDP of 10 Watts. This suggests that the Kirin 9000 5G may offer superior thermal performance.

In summary, the HiSilicon Kirin 9000 5G stands out with its more advanced CPU architecture, higher clock speeds, comprehensive neural processing system, and enhanced power efficiency due to its 5 nm lithography and lower TDP. The MediaTek Dimensity 720, while still capable, may not offer the same level of performance and efficiency as the Kirin 9000 5G in these areas.

CPU cores and architecture

Architecture 1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
2x 2.2 GHz – Cortex-A76
6x 2 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8.2-A ARMv8.2-A
Lithography 5 nm 7 nm
Number of transistors 15300 million
TDP 6 Watt 10 Watt
Neural Processing Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 NPU

Memory (RAM)

Max amount up to 16 GB up to 12 GB
Memory type LPDDR5 LPDDR4X
Memory frequency 2750 MHz 2133 MHz
Memory-bus 4x16 bit 2x16 bit

Storage

Storage specification UFS 3.1 UFS 2.2

Graphics

GPU name Mali-G78 MP24 Mali-G57 MP3
GPU Architecture Valhall Valhall
GPU frequency 760 MHz 850 MHz
Execution units 24 3
Shaders 384
DirectX 12 12
OpenCL API 2.1 2.1
OpenGL API ES 3.2 ES 3.2
Vulkan API 1.2 1.2

Camera, Video, Display

Max screen resolution 3840x2160 2520x1080@90Hz
Max camera resolution 1x 64MP, 1x 20MP + 1x 16MP
Max Video Capture 4K@60fps 4K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 4.6 Gbps 2.77 Gbps
Peak Upload Speed 2.5 Gbps 1.2 Gbps
Wi-Fi 6 (802.11ax) 5 (802.11ac)
Bluetooth 5.2 5.1
Satellite navigation BeiDou
GPS
Galileo
GLONASS
NavIC
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2020 October 2020 Quarter 3
Partnumber MT6853V/ZA, MT6853V/NZA
Vertical Segment Mobiles Mobiles
Positioning Flagship Mid-end

AnTuTu 10

Total Score
Kirin 9000 5G
762886
Dimensity 720
293337

GeekBench 6 Single-Core

Score
Kirin 9000 5G
1062
Dimensity 720
540

GeekBench 6 Multi-Core

Score
Kirin 9000 5G
3724
Dimensity 720
1698