HiSilicon Kirin 710F vs Unisoc Tiger T700
The HiSilicon Kirin 710F and the Unisoc Tiger T700 are two processors that cater to different needs and preferences. Let's compare their specifications to understand their differences.
Starting with the HiSilicon Kirin 710F, it features a combination of four Cortex-A73 cores clocked at 2.2 GHz and four Cortex-A53 cores clocked at 1.7 GHz. This octa-core processor is based on the ARMv8-A instruction set and is built using a 12 nm lithography process. With a total of 5500 million transistors, it offers a balance between power and efficiency. The Kirin 710F has a TDP (Thermal Design Power) of 5 Watts, which indicates its power consumption.
On the other hand, the Unisoc Tiger T700 is equipped with a different architecture consisting of two Cortex-A75 cores clocked at 1.8 GHz and six Cortex-A5 cores also clocked at 1.8 GHz. Like the Kirin 710F, it is an octa-core processor and employs the ARMv8.2-A instruction set. It is manufactured using a 12 nm lithography process. However, the T700 has a higher TDP of 10 Watts, suggesting that it may consume more power compared to the Kirin 710F.
Looking at these specifications, it is evident that the two processors differ in terms of their CPU cores and architecture. The Kirin 710F provides a higher clock speed for its four high-performance cores (Cortex-A73) compared to the Tiger T700's two Cortex-A75 cores. This indicates that the Kirin 710F may offer better single-core performance. However, the T700 compensates for this with a higher number of cores, which potentially allows for better multithreaded performance.
Additionally, the Kirin 710F has a lower TDP, suggesting that it may be more power-efficient compared to the Tiger T700. This could be important for devices that prioritize battery life.
In conclusion, the HiSilicon Kirin 710F and the Unisoc Tiger T700 differ in their CPU cores and architecture, clock speeds, and power consumption. The choice between these processors ultimately depends on the specific requirements and preferences of the user or the device they will be used in.
Starting with the HiSilicon Kirin 710F, it features a combination of four Cortex-A73 cores clocked at 2.2 GHz and four Cortex-A53 cores clocked at 1.7 GHz. This octa-core processor is based on the ARMv8-A instruction set and is built using a 12 nm lithography process. With a total of 5500 million transistors, it offers a balance between power and efficiency. The Kirin 710F has a TDP (Thermal Design Power) of 5 Watts, which indicates its power consumption.
On the other hand, the Unisoc Tiger T700 is equipped with a different architecture consisting of two Cortex-A75 cores clocked at 1.8 GHz and six Cortex-A5 cores also clocked at 1.8 GHz. Like the Kirin 710F, it is an octa-core processor and employs the ARMv8.2-A instruction set. It is manufactured using a 12 nm lithography process. However, the T700 has a higher TDP of 10 Watts, suggesting that it may consume more power compared to the Kirin 710F.
Looking at these specifications, it is evident that the two processors differ in terms of their CPU cores and architecture. The Kirin 710F provides a higher clock speed for its four high-performance cores (Cortex-A73) compared to the Tiger T700's two Cortex-A75 cores. This indicates that the Kirin 710F may offer better single-core performance. However, the T700 compensates for this with a higher number of cores, which potentially allows for better multithreaded performance.
Additionally, the Kirin 710F has a lower TDP, suggesting that it may be more power-efficient compared to the Tiger T700. This could be important for devices that prioritize battery life.
In conclusion, the HiSilicon Kirin 710F and the Unisoc Tiger T700 differ in their CPU cores and architecture, clock speeds, and power consumption. The choice between these processors ultimately depends on the specific requirements and preferences of the user or the device they will be used in.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A5 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 12 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt | 10 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 4 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 1866 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G52 MP2 |
GPU Architecture | Bifrost | Bifrost |
GPU frequency | 650 MHz | 850 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 2 |
Shaders | 64 | 32 |
DirectX | 12 | 11 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2400x1080 |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 48MP |
Max Video Capture | FullHD@60fps | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2019 Quarter 1 | 2021 March |
Partnumber | Hi6260 | T700 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Low-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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