HiSilicon Kirin 710F vs MediaTek Dimensity 930

The HiSilicon Kirin 710F and MediaTek Dimensity 930 are two processors that cater to different segments of the market. Let's compare their specifications to see how they stack up against each other.

The HiSilicon Kirin 710F features a CPU architecture of 4x 2.2 GHz Cortex-A73 and 4x 1.7 GHz Cortex-A53 cores. With a total of eight cores, this processor offers a balanced combination of performance and power efficiency. It operates on the ARMv8-A instruction set and has a lithography of 12 nm, indicating decent efficiency in power consumption. With 5500 million transistors, the Kirin 710F provides adequate performance for both everyday tasks and moderate gaming. Its TDP (Thermal Design Power) is 5 Watts, which ensures minimal heat generation during prolonged use.

On the other hand, the MediaTek Dimensity 930 boasts a more advanced CPU architecture with 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. This configuration indicates a greater emphasis on performance, especially with the inclusion of Cortex-A78 cores known for their efficiency. The Dimensity 930 also supports the ARMv8.2-A instruction set, which signifies improved compatibility and innovative features. With a lithography of 6 nm, this processor is constructed using a more advanced manufacturing process, yielding higher efficiency and performance. Additionally, the inclusion of an NPU (Neural Processing Unit) allows for AI-driven applications and enhanced efficiency in specific tasks. The TDP of the Dimensity 930 is 10 Watts, indicating a slightly higher power usage compared to the Kirin 710F.

In summary, while both processors feature eight cores and support the ARM architecture, the HiSilicon Kirin 710F focuses on a balanced performance and energy efficiency. On the other hand, the MediaTek Dimensity 930 places a greater emphasis on performance and advanced features, showcasing a more power-intensive design. Ultimately, the choice between these two processors mainly depends on the specific requirements and preferences of the intended usage, be it heavy multitasking, gaming, or AI-driven tasks.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
2x 2.2 GHz – Cortex-A78
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 12 nm 6 nm
Number of transistors 5500 million
TDP 5 Watt 10 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 6 GB up to 16 GB
Memory type LPDDR4 LPDDR5
Memory frequency 1866 MHz 3200 MHz
Memory-bus 2x32 bit 4x16 bit


Storage specification UFS 2.1 UFS 3.1


GPU name Mali-G51 MP4 Imagination PowerVR BXM-8-256
GPU Architecture Bifrost Rogue
GPU frequency 650 MHz 800 MHz
GPU boost frequency 1000 MHz
Execution units 4
Shaders 64
DirectX 12 12
OpenCL API 2.0 3.0
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 24MP 1x 108MP, 1x 64MP
Max Video Capture 2K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
H.264 (AVC)
H.265 (HEVC)


4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 4 (802.11n) 5 (802.11ac)
Bluetooth 4.2 5.2
Satellite navigation BeiDou

Supplemental Information

Launch Date 2019 Quarter 1 2022 Quarter 3
Partnumber Hi6260
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 710F
Dimensity 930

GeekBench 6 Single-Core

Kirin 710F
Dimensity 930

GeekBench 6 Multi-Core

Kirin 710F
Dimensity 930