HiSilicon Kirin 710F vs MediaTek Dimensity 930
The HiSilicon Kirin 710F and MediaTek Dimensity 930 are two processors that cater to different segments of the market. Let's compare their specifications to see how they stack up against each other.
The HiSilicon Kirin 710F features a CPU architecture of 4x 2.2 GHz Cortex-A73 and 4x 1.7 GHz Cortex-A53 cores. With a total of eight cores, this processor offers a balanced combination of performance and power efficiency. It operates on the ARMv8-A instruction set and has a lithography of 12 nm, indicating decent efficiency in power consumption. With 5500 million transistors, the Kirin 710F provides adequate performance for both everyday tasks and moderate gaming. Its TDP (Thermal Design Power) is 5 Watts, which ensures minimal heat generation during prolonged use.
On the other hand, the MediaTek Dimensity 930 boasts a more advanced CPU architecture with 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. This configuration indicates a greater emphasis on performance, especially with the inclusion of Cortex-A78 cores known for their efficiency. The Dimensity 930 also supports the ARMv8.2-A instruction set, which signifies improved compatibility and innovative features. With a lithography of 6 nm, this processor is constructed using a more advanced manufacturing process, yielding higher efficiency and performance. Additionally, the inclusion of an NPU (Neural Processing Unit) allows for AI-driven applications and enhanced efficiency in specific tasks. The TDP of the Dimensity 930 is 10 Watts, indicating a slightly higher power usage compared to the Kirin 710F.
In summary, while both processors feature eight cores and support the ARM architecture, the HiSilicon Kirin 710F focuses on a balanced performance and energy efficiency. On the other hand, the MediaTek Dimensity 930 places a greater emphasis on performance and advanced features, showcasing a more power-intensive design. Ultimately, the choice between these two processors mainly depends on the specific requirements and preferences of the intended usage, be it heavy multitasking, gaming, or AI-driven tasks.
The HiSilicon Kirin 710F features a CPU architecture of 4x 2.2 GHz Cortex-A73 and 4x 1.7 GHz Cortex-A53 cores. With a total of eight cores, this processor offers a balanced combination of performance and power efficiency. It operates on the ARMv8-A instruction set and has a lithography of 12 nm, indicating decent efficiency in power consumption. With 5500 million transistors, the Kirin 710F provides adequate performance for both everyday tasks and moderate gaming. Its TDP (Thermal Design Power) is 5 Watts, which ensures minimal heat generation during prolonged use.
On the other hand, the MediaTek Dimensity 930 boasts a more advanced CPU architecture with 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores. This configuration indicates a greater emphasis on performance, especially with the inclusion of Cortex-A78 cores known for their efficiency. The Dimensity 930 also supports the ARMv8.2-A instruction set, which signifies improved compatibility and innovative features. With a lithography of 6 nm, this processor is constructed using a more advanced manufacturing process, yielding higher efficiency and performance. Additionally, the inclusion of an NPU (Neural Processing Unit) allows for AI-driven applications and enhanced efficiency in specific tasks. The TDP of the Dimensity 930 is 10 Watts, indicating a slightly higher power usage compared to the Kirin 710F.
In summary, while both processors feature eight cores and support the ARM architecture, the HiSilicon Kirin 710F focuses on a balanced performance and energy efficiency. On the other hand, the MediaTek Dimensity 930 places a greater emphasis on performance and advanced features, showcasing a more power-intensive design. Ultimately, the choice between these two processors mainly depends on the specific requirements and preferences of the intended usage, be it heavy multitasking, gaming, or AI-driven tasks.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 2.2 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 6 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR5 |
Memory frequency | 1866 MHz | 3200 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G51 MP4 | Imagination PowerVR BXM-8-256 |
GPU Architecture | Bifrost | Rogue |
GPU frequency | 650 MHz | 800 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | |
Shaders | 64 | |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 3.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2520x1080@120Hz |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 108MP, 1x 64MP |
Max Video Capture | 2K@30fps | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2019 Quarter 1 | 2022 Quarter 3 |
Partnumber | Hi6260 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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