HiSilicon Kirin 710F vs MediaTek Dimensity 800U

The HiSilicon Kirin 710F and the MediaTek Dimensity 800U are two processors with different specifications. Starting with the HiSilicon Kirin 710F, it is built on a 12 nm lithography process and features a total of 8 cores. Its architecture includes 4 Cortex-A73 cores clocked at 2.2 GHz and 4 Cortex-A53 cores clocked at 1.7 GHz. With its ARMv8-A instruction set, this processor features a total of 5500 million transistors and has a thermal design power (TDP) of 5 Watts.

On the other hand, the MediaTek Dimensity 800U is built on a more advanced 7 nm lithography process. Like the Kirin 710F, it also features 8 cores. However, its architecture consists of 2 Cortex-A76 cores clocked at 2.4 GHz and 6 Cortex-A55 cores clocked at 2.0 GHz. The Dimensity 800U supports the ARMv8.2-A instruction set and also includes a Neural Processing Unit (NPU). The presence of an NPU enhances the processing power and capabilities of the processor, especially for tasks related to artificial intelligence and machine learning.

In terms of lithography, the Dimensity 800U has a clear advantage with its 7 nm process compared to the Kirin 710F's 12 nm process. This allows for better power efficiency and potentially higher performance due to the smaller size of the transistors. Additionally, the inclusion of the NPU in the Dimensity 800U further enhances its capabilities, particularly in tasks that require AI processing.

Both processors have their strengths and weaknesses. The Kirin 710F may offer more balanced performance with its combination of Cortex-A73 and Cortex-A53 cores, while the Dimensity 800U's more powerful Cortex-A76 cores may provide better overall performance. However, the Dimensity 800U's smaller lithography process and inclusion of an NPU may offer advantages in terms of power efficiency and AI-related tasks.

Ultimately, the choice between these two processors will depend on the specific requirements and priorities of the user or the device manufacturer.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
2x 2.4 GHz – Cortex-A76
6x 2.0 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 12 nm 7 nm
Number of transistors 5500 million
TDP 5 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 6 GB up to 12 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 2x32 bit 2x16 bit


Storage specification UFS 2.1 UFS 2.2


GPU name Mali-G51 MP4 Mali-G57 MP3
GPU Architecture Bifrost Valhall
GPU frequency 650 MHz 850 MHz
GPU boost frequency 1000 MHz
Execution units 4 3
Shaders 64 48
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 24MP 1x 64MP, 1x 20MP + 1x 16MP
Max Video Capture 4K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
H.264 (AVC)
H.265 (HEVC)


4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 4 (802.11n) 5 (802.11ac)
Bluetooth 4.2 5.1
Satellite navigation BeiDou

Supplemental Information

Launch Date 2019 Quarter 1 2020 Quarter 3
Partnumber Hi6260 MT6853V, MT6853V/TNZA, MT6853/TNZA, MT6853T
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 710F
Dimensity 800U

GeekBench 6 Single-Core

Kirin 710F
Dimensity 800U

GeekBench 6 Multi-Core

Kirin 710F
Dimensity 800U