HiSilicon Kirin 710F vs MediaTek Dimensity 800U
The HiSilicon Kirin 710F and the MediaTek Dimensity 800U are two processors with different specifications. Starting with the HiSilicon Kirin 710F, it is built on a 12 nm lithography process and features a total of 8 cores. Its architecture includes 4 Cortex-A73 cores clocked at 2.2 GHz and 4 Cortex-A53 cores clocked at 1.7 GHz. With its ARMv8-A instruction set, this processor features a total of 5500 million transistors and has a thermal design power (TDP) of 5 Watts.
On the other hand, the MediaTek Dimensity 800U is built on a more advanced 7 nm lithography process. Like the Kirin 710F, it also features 8 cores. However, its architecture consists of 2 Cortex-A76 cores clocked at 2.4 GHz and 6 Cortex-A55 cores clocked at 2.0 GHz. The Dimensity 800U supports the ARMv8.2-A instruction set and also includes a Neural Processing Unit (NPU). The presence of an NPU enhances the processing power and capabilities of the processor, especially for tasks related to artificial intelligence and machine learning.
In terms of lithography, the Dimensity 800U has a clear advantage with its 7 nm process compared to the Kirin 710F's 12 nm process. This allows for better power efficiency and potentially higher performance due to the smaller size of the transistors. Additionally, the inclusion of the NPU in the Dimensity 800U further enhances its capabilities, particularly in tasks that require AI processing.
Both processors have their strengths and weaknesses. The Kirin 710F may offer more balanced performance with its combination of Cortex-A73 and Cortex-A53 cores, while the Dimensity 800U's more powerful Cortex-A76 cores may provide better overall performance. However, the Dimensity 800U's smaller lithography process and inclusion of an NPU may offer advantages in terms of power efficiency and AI-related tasks.
Ultimately, the choice between these two processors will depend on the specific requirements and priorities of the user or the device manufacturer.
On the other hand, the MediaTek Dimensity 800U is built on a more advanced 7 nm lithography process. Like the Kirin 710F, it also features 8 cores. However, its architecture consists of 2 Cortex-A76 cores clocked at 2.4 GHz and 6 Cortex-A55 cores clocked at 2.0 GHz. The Dimensity 800U supports the ARMv8.2-A instruction set and also includes a Neural Processing Unit (NPU). The presence of an NPU enhances the processing power and capabilities of the processor, especially for tasks related to artificial intelligence and machine learning.
In terms of lithography, the Dimensity 800U has a clear advantage with its 7 nm process compared to the Kirin 710F's 12 nm process. This allows for better power efficiency and potentially higher performance due to the smaller size of the transistors. Additionally, the inclusion of the NPU in the Dimensity 800U further enhances its capabilities, particularly in tasks that require AI processing.
Both processors have their strengths and weaknesses. The Kirin 710F may offer more balanced performance with its combination of Cortex-A73 and Cortex-A53 cores, while the Dimensity 800U's more powerful Cortex-A76 cores may provide better overall performance. However, the Dimensity 800U's smaller lithography process and inclusion of an NPU may offer advantages in terms of power efficiency and AI-related tasks.
Ultimately, the choice between these two processors will depend on the specific requirements and priorities of the user or the device manufacturer.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 2.4 GHz – Cortex-A76 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 7 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt | |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 12 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G57 MP3 |
GPU Architecture | Mali Bifrost | Mali Valhall |
GPU frequency | 1000 MHz | 850 MHz |
Execution units | 4 | 3 |
Shaders | 64 | 48 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2520x1080@120Hz |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 64MP, 1x 20MP + 1x 16MP |
Max Video Capture | 4K@30FPS | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2019 Quarter 1 | 2020 Quarter 3 |
Partnumber | Hi6260 | MT6853V, MT6853V/TNZA, MT6853/TNZA, MT6853T |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
Popular comparisons:
1
MediaTek Dimensity 7020 vs Apple A12 Bionic
2
Unisoc Tiger T610 vs Qualcomm Snapdragon 8 Elite (Gen 4)
3
Samsung Exynos 2400e vs Apple A15 Bionic
4
Qualcomm Snapdragon 460 vs MediaTek Dimensity 6400
5
MediaTek Dimensity 9300 vs Unisoc Tiger T615
6
Samsung Exynos 7870 vs HiSilicon Kirin 8000
7
MediaTek Helio G88 vs Qualcomm Snapdragon 6 Gen 4
8
Samsung Exynos 7904 vs MediaTek Dimensity 6020
9
HiSilicon Kirin 659 vs Qualcomm Snapdragon 780G
10
Qualcomm Snapdragon 730G vs Qualcomm Snapdragon 6 Gen 1