HiSilicon Kirin 710F vs MediaTek Dimensity 800
The HiSilicon Kirin 710F and the MediaTek Dimensity 800 are both processors commonly used in smartphones and other devices. While they share some similarities, they also have distinct differences in their specifications.
In terms of their CPU cores and architecture, the Kirin 710F features 8 cores with a combination of 4x 2.2 GHz Cortex-A73 and 4x 1.7 GHz Cortex-A53. On the other hand, the Dimensity 800 has 4x 2.0 GHz Cortex-A76 and 4x 2.0 GHz Cortex-A55 cores. This suggests that the Kirin has a slightly higher clock speed for its A73 cores, while the Dimensity 800 has a more balanced distribution of performance across its cores.
Both processors are based on the ARM architecture, with the Kirin 710F supporting ARMv8-A instruction set and the Dimensity 800 supporting ARMv8.2-A. This means that both processors are capable of handling modern software and applications efficiently.
Another significant difference is their lithography process. The Kirin 710F is built on a 12 nm process, while the Dimensity 800 is built on a more advanced 7 nm process. The smaller lithography allows for more transistors to be packed into a smaller space, resulting in improved power efficiency and potentially better overall performance for the Dimensity 800.
When it comes to power consumption, the Kirin 710F has a TDP (Thermal Design Power) of 5 Watts, while the Dimensity 800 has a TDP of 10 Watts. This suggests that the Kirin 710F is more power-efficient, which can potentially result in better battery life for devices powered by this processor.
Moreover, the Dimensity 800 includes a Neural Processing Unit (NPU), which enables it to handle AI-related tasks more efficiently. This feature can be beneficial for applications that heavily rely on artificial intelligence, such as image recognition or voice assistants.
In conclusion, while both the HiSilicon Kirin 710F and the MediaTek Dimensity 800 have their strengths, they differ in terms of their CPU cores, architecture, lithography process, and power consumption. The Kirin 710F offers higher clock speeds and a more power-efficient design, while the Dimensity 800 has a more advanced lithography process and includes an NPU for enhanced AI capabilities. Ultimately, the choice between these processors would depend on the specific requirements and priorities of the device being used.
In terms of their CPU cores and architecture, the Kirin 710F features 8 cores with a combination of 4x 2.2 GHz Cortex-A73 and 4x 1.7 GHz Cortex-A53. On the other hand, the Dimensity 800 has 4x 2.0 GHz Cortex-A76 and 4x 2.0 GHz Cortex-A55 cores. This suggests that the Kirin has a slightly higher clock speed for its A73 cores, while the Dimensity 800 has a more balanced distribution of performance across its cores.
Both processors are based on the ARM architecture, with the Kirin 710F supporting ARMv8-A instruction set and the Dimensity 800 supporting ARMv8.2-A. This means that both processors are capable of handling modern software and applications efficiently.
Another significant difference is their lithography process. The Kirin 710F is built on a 12 nm process, while the Dimensity 800 is built on a more advanced 7 nm process. The smaller lithography allows for more transistors to be packed into a smaller space, resulting in improved power efficiency and potentially better overall performance for the Dimensity 800.
When it comes to power consumption, the Kirin 710F has a TDP (Thermal Design Power) of 5 Watts, while the Dimensity 800 has a TDP of 10 Watts. This suggests that the Kirin 710F is more power-efficient, which can potentially result in better battery life for devices powered by this processor.
Moreover, the Dimensity 800 includes a Neural Processing Unit (NPU), which enables it to handle AI-related tasks more efficiently. This feature can be beneficial for applications that heavily rely on artificial intelligence, such as image recognition or voice assistants.
In conclusion, while both the HiSilicon Kirin 710F and the MediaTek Dimensity 800 have their strengths, they differ in terms of their CPU cores, architecture, lithography process, and power consumption. The Kirin 710F offers higher clock speeds and a more power-efficient design, while the Dimensity 800 has a more advanced lithography process and includes an NPU for enhanced AI capabilities. Ultimately, the choice between these processors would depend on the specific requirements and priorities of the device being used.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
4x 2.0 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 7 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G57 MP4 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 650 MHz | 650 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 4 |
Shaders | 64 | 64 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2520x1080@120Hz |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 80MP, 1x 32MP + 1x 16MP |
Max Video Capture | 4K@30FPS | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2019 Quarter 1 | 2020 Quarter 2 |
Partnumber | Hi6260 | MT6873, MT6873V |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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