HiSilicon Kirin 710F vs MediaTek Dimensity 800

The HiSilicon Kirin 710F and the MediaTek Dimensity 800 are both processors commonly used in smartphones and other devices. While they share some similarities, they also have distinct differences in their specifications.

In terms of their CPU cores and architecture, the Kirin 710F features 8 cores with a combination of 4x 2.2 GHz Cortex-A73 and 4x 1.7 GHz Cortex-A53. On the other hand, the Dimensity 800 has 4x 2.0 GHz Cortex-A76 and 4x 2.0 GHz Cortex-A55 cores. This suggests that the Kirin has a slightly higher clock speed for its A73 cores, while the Dimensity 800 has a more balanced distribution of performance across its cores.

Both processors are based on the ARM architecture, with the Kirin 710F supporting ARMv8-A instruction set and the Dimensity 800 supporting ARMv8.2-A. This means that both processors are capable of handling modern software and applications efficiently.

Another significant difference is their lithography process. The Kirin 710F is built on a 12 nm process, while the Dimensity 800 is built on a more advanced 7 nm process. The smaller lithography allows for more transistors to be packed into a smaller space, resulting in improved power efficiency and potentially better overall performance for the Dimensity 800.

When it comes to power consumption, the Kirin 710F has a TDP (Thermal Design Power) of 5 Watts, while the Dimensity 800 has a TDP of 10 Watts. This suggests that the Kirin 710F is more power-efficient, which can potentially result in better battery life for devices powered by this processor.

Moreover, the Dimensity 800 includes a Neural Processing Unit (NPU), which enables it to handle AI-related tasks more efficiently. This feature can be beneficial for applications that heavily rely on artificial intelligence, such as image recognition or voice assistants.

In conclusion, while both the HiSilicon Kirin 710F and the MediaTek Dimensity 800 have their strengths, they differ in terms of their CPU cores, architecture, lithography process, and power consumption. The Kirin 710F offers higher clock speeds and a more power-efficient design, while the Dimensity 800 has a more advanced lithography process and includes an NPU for enhanced AI capabilities. Ultimately, the choice between these processors would depend on the specific requirements and priorities of the device being used.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
4x 2.0 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
Number of cores 8 4
Instruction Set ARMv8-A ARMv8.2-A
Lithography 12 nm 7 nm
Number of transistors 5500 million
TDP 5 Watt 10 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 6 GB up to 16 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 2x32 bit 2x16 bit


Storage specification UFS 2.1 UFS 2.2


GPU name Mali-G51 MP4 Mali-G57 MP4
GPU Architecture Bifrost Valhall
GPU frequency 650 MHz 650 MHz
GPU boost frequency 1000 MHz
Execution units 4 4
Shaders 64 64
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 24MP 1x 80MP, 1x 32MP + 1x 16MP
Max Video Capture 4K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
H.264 (AVC)
H.265 (HEVC)


4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 4 (802.11n) 5 (802.11ac)
Bluetooth 4.2 5.1
Satellite navigation BeiDou

Supplemental Information

Launch Date 2019 Quarter 1 2020 Quarter 2
Partnumber Hi6260 MT6873, MT6873V
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 710F
Dimensity 800

GeekBench 6 Single-Core

Kirin 710F
Dimensity 800

GeekBench 6 Multi-Core

Kirin 710F
Dimensity 800