HiSilicon Kirin 710F vs MediaTek Dimensity 720
The HiSilicon Kirin 710F and the MediaTek Dimensity 720 are both processors used in smartphones, but they have distinct differences in their specifications.
Starting with the HiSilicon Kirin 710F, it features an architecture of 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. With a total of 8 cores, it provides a balanced mix of performance and power efficiency. The 12 nm lithography allows for decent power management and efficiency, making it suitable for mid-range smartphones. With 5500 million transistors, it offers a solid level of processing power. The TDP (thermal design power) is 5 Watt, indicating low power consumption.
On the other hand, the MediaTek Dimensity 720 has a different architecture. It has 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. This configuration places more emphasis on performance, making it more suitable for mid-range to high-end smartphones. The 7 nm lithography provides better power efficiency compared to the HiSilicon Kirin 710F. Additionally, the Dimensity 720 includes a Neural Processing Unit (NPU), which accelerates AI tasks.
In terms of core count, both processors have 8 cores, ensuring a solid multitasking experience. The instruction set for both processors is ARMv8-A, allowing for compatibility with a wide range of applications and software.
Comparing TDP, the HiSilicon Kirin 710F has a lower rating of 5 Watt, indicating lower power consumption. On the other hand, the Dimensity 720 has a TDP of 10 Watt, suggesting it may consume more power, potentially affecting battery life.
Overall, the HiSilicon Kirin 710F is well-suited for mid-range smartphones, offering a balanced mix of performance and power efficiency. On the other hand, the MediaTek Dimensity 720 is more suitable for smartphones that prioritize performance, with its higher clock speeds and inclusion of an NPU. However, it may come at the expense of higher power consumption.
When selecting between these two processors, it ultimately depends on the specific requirements and priorities of the smartphone manufacturer and consumer.
Starting with the HiSilicon Kirin 710F, it features an architecture of 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. With a total of 8 cores, it provides a balanced mix of performance and power efficiency. The 12 nm lithography allows for decent power management and efficiency, making it suitable for mid-range smartphones. With 5500 million transistors, it offers a solid level of processing power. The TDP (thermal design power) is 5 Watt, indicating low power consumption.
On the other hand, the MediaTek Dimensity 720 has a different architecture. It has 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. This configuration places more emphasis on performance, making it more suitable for mid-range to high-end smartphones. The 7 nm lithography provides better power efficiency compared to the HiSilicon Kirin 710F. Additionally, the Dimensity 720 includes a Neural Processing Unit (NPU), which accelerates AI tasks.
In terms of core count, both processors have 8 cores, ensuring a solid multitasking experience. The instruction set for both processors is ARMv8-A, allowing for compatibility with a wide range of applications and software.
Comparing TDP, the HiSilicon Kirin 710F has a lower rating of 5 Watt, indicating lower power consumption. On the other hand, the Dimensity 720 has a TDP of 10 Watt, suggesting it may consume more power, potentially affecting battery life.
Overall, the HiSilicon Kirin 710F is well-suited for mid-range smartphones, offering a balanced mix of performance and power efficiency. On the other hand, the MediaTek Dimensity 720 is more suitable for smartphones that prioritize performance, with its higher clock speeds and inclusion of an NPU. However, it may come at the expense of higher power consumption.
When selecting between these two processors, it ultimately depends on the specific requirements and priorities of the smartphone manufacturer and consumer.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 7 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 12 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G57 MP3 |
GPU Architecture | Mali Bifrost | Mali Valhall |
GPU frequency | 1000 MHz | 850 MHz |
Execution units | 4 | 3 |
Shaders | 64 | |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2520x1080@90Hz |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 64MP, 1x 20MP + 1x 16MP |
Max Video Capture | 4K@30FPS | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2019 Quarter 1 | 2020 Quarter 3 |
Partnumber | Hi6260 | MT6853V/ZA, MT6853V/NZA |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
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