HiSilicon Kirin 710F vs MediaTek Dimensity 720

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The HiSilicon Kirin 710F and the MediaTek Dimensity 720 are both processors used in smartphones, but they have distinct differences in their specifications.

Starting with the HiSilicon Kirin 710F, it features an architecture of 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. With a total of 8 cores, it provides a balanced mix of performance and power efficiency. The 12 nm lithography allows for decent power management and efficiency, making it suitable for mid-range smartphones. With 5500 million transistors, it offers a solid level of processing power. The TDP (thermal design power) is 5 Watt, indicating low power consumption.

On the other hand, the MediaTek Dimensity 720 has a different architecture. It has 2x 2.2 GHz Cortex-A76 cores and 6x 2 GHz Cortex-A55 cores. This configuration places more emphasis on performance, making it more suitable for mid-range to high-end smartphones. The 7 nm lithography provides better power efficiency compared to the HiSilicon Kirin 710F. Additionally, the Dimensity 720 includes a Neural Processing Unit (NPU), which accelerates AI tasks.

In terms of core count, both processors have 8 cores, ensuring a solid multitasking experience. The instruction set for both processors is ARMv8-A, allowing for compatibility with a wide range of applications and software.

Comparing TDP, the HiSilicon Kirin 710F has a lower rating of 5 Watt, indicating lower power consumption. On the other hand, the Dimensity 720 has a TDP of 10 Watt, suggesting it may consume more power, potentially affecting battery life.

Overall, the HiSilicon Kirin 710F is well-suited for mid-range smartphones, offering a balanced mix of performance and power efficiency. On the other hand, the MediaTek Dimensity 720 is more suitable for smartphones that prioritize performance, with its higher clock speeds and inclusion of an NPU. However, it may come at the expense of higher power consumption.

When selecting between these two processors, it ultimately depends on the specific requirements and priorities of the smartphone manufacturer and consumer.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
2x 2.2 GHz – Cortex-A76
6x 2 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 12 nm 7 nm
Number of transistors 5500 million
TDP 5 Watt 10 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 6 GB up to 12 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 2x32 bit 2x16 bit

Storage

Storage specification UFS 2.1 UFS 2.2

Graphics

GPU name Mali-G51 MP4 Mali-G57 MP3
GPU Architecture Bifrost Valhall
GPU frequency 650 MHz 850 MHz
GPU boost frequency 1000 MHz
Execution units 4 3
Shaders 64
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2520x1080@90Hz
Max camera resolution 1x 48MP, 2x 24MP 1x 64MP, 1x 20MP + 1x 16MP
Max Video Capture 4K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 4 (802.11n) 5 (802.11ac)
Bluetooth 4.2 5.1
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC
QZSS

Supplemental Information

Launch Date 2019 Quarter 1 2020 Quarter 3
Partnumber Hi6260 MT6853V/ZA, MT6853V/NZA
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 710F
195573
Dimensity 720
293337

GeekBench 6 Single-Core

Score
Kirin 710F
329
Dimensity 720
540

GeekBench 6 Multi-Core

Score
Kirin 710F
1341
Dimensity 720
1698