HiSilicon Kirin 710F vs HiSilicon Kirin 960

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The HiSilicon Kirin 710F and HiSilicon Kirin 960 are two processors that target different segments of the market. While both processors are designed by HiSilicon and utilize ARMv8-A instruction set architecture, there are notable differences in their specifications.

In terms of CPU cores and architecture, the Kirin 710F features a configuration of 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. On the other hand, the Kirin 960 boasts a slightly higher performance with 4x 2.4 GHz Cortex-A73 cores and 4x 1.8 GHz Cortex-A53 cores. This indicates that the Kirin 960 will have a slight advantage in processing speed and multitasking capabilities.

When it comes to lithography, the Kirin 710F employs a 12 nm process, while the Kirin 960 adopts a 16 nm process. Smaller lithography typically translates to better power efficiency and potentially better thermal performance. Therefore, the Kirin 710F may have a slight edge in terms of power consumption.

In terms of the number of transistors, the Kirin 710F incorporates 5500 million transistors, whereas the Kirin 960 utilizes 4000 million transistors. A higher number of transistors usually indicates a more complex and feature-rich design, which can result in better overall performance. Therefore, the Kirin 710F may offer superior performance compared to the Kirin 960.

Both processors have a thermal design power (TDP) of 5 Watts. This suggests that they are designed to operate efficiently within a similar power envelope. Therefore, in terms of power consumption, these processors are on par with each other.

In summary, the HiSilicon Kirin 710F excels in terms of lithography and transistor count, potentially offering better power efficiency and overall performance. Conversely, the HiSilicon Kirin 960 outperforms the Kirin 710F in CPU clock speeds, indicating better processing capabilities. Ultimately, the choice between these processors will depend on the specific requirements of the device or application in which they are used.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
4x 2.4 GHz – Cortex-A73
4x 1.8 GHz – Cortex-A53
Number of cores 8 8
Instruction Set ARMv8-A ARMv8-A
Lithography 12 nm 16 nm
Number of transistors 5500 million 4000 million
TDP 5 Watt 5 Watt

Memory (RAM)

Max amount up to 6 GB up to 6 GB
Memory type LPDDR4 LPDDR4
Memory frequency 1866 MHz 1866 MHz
Memory-bus 2x32 bit 2x32 bit

Storage

Storage specification UFS 2.1 UFS 2.1

Graphics

GPU name Mali-G51 MP4 Mali-G71 MP8
GPU Architecture Bifrost Bifrost
GPU frequency 650 MHz 900 MHz
GPU boost frequency 1000 MHz
Execution units 4 8
Shaders 64 128
DirectX 12 11.3
OpenCL API 2.0 1.2
Vulkan API 1.0 1.0

Camera, Video, Display

Max screen resolution 2340x1080
Max camera resolution 1x 48MP, 2x 24MP 1x 20MP, 2x 12MP
Max Video Capture 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 0.6 Gbps
Peak Upload Speed 0.15 Gbps 0.15 Gbps
Wi-Fi 4 (802.11n) 5 (802.11ac)
Bluetooth 4.2 4.2
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2019 Quarter 1 2016 October
Partnumber Hi6260 Hi3660
Vertical Segment Mobiles Mobiles
Positioning Mid-end Flagship

AnTuTu 10

Total Score
Kirin 710F
195573
Kirin 960
253892

GeekBench 6 Single-Core

Score
Kirin 710F
329
Kirin 960
382

GeekBench 6 Multi-Core

Score
Kirin 710F
1341
Kirin 960
1544