HiSilicon Kirin 710F vs HiSilicon Kirin 955
The HiSilicon Kirin 710F and HiSilicon Kirin 955 are two processors that belong to the same manufacturer but have different specifications. Let's compare the two based on their specifications.
In terms of CPU cores and architecture, both processors have 8 cores. The Kirin 710F features a 4x 2.2 GHz Cortex-A73 and 4x 1.7 GHz Cortex-A53 architecture. On the other hand, the Kirin 955 has a 4x 2.5 GHz Cortex-A72 and 4x 1.8 GHz Cortex-A53 architecture. This means that the Kirin 955 has slightly higher clock speeds for both its high-performance and power-efficient cores, giving it an edge in terms of processing power.
When it comes to instruction sets, both processors support the ARMv8-A instruction set, which is commonly used in modern processors. Therefore, there is no significant difference between the two in this aspect.
In terms of lithography, the Kirin 710F is manufactured using a 12 nm process, while the Kirin 955 is manufactured using a slightly less advanced 16 nm process. A smaller lithography generally allows for better power efficiency and performance, which gives the Kirin 710F an advantage over the Kirin 955 in this regard.
The number of transistors in a processor can also impact its performance. The Kirin 710F has 5500 million transistors, whereas the Kirin 955 has 2000 million transistors. This indicates that the Kirin 710F has a higher transistor count, which can contribute to better performance and efficiency compared to the Kirin 955.
Lastly, both processors have the same thermal design power (TDP) of 5 Watts, suggesting that they consume a similar amount of power when operating at their maximum capacity.
In conclusion, the HiSilicon Kirin 710F offers better lithography, a higher number of transistors, and a comparable instruction set as compared to the Kirin 955. However, the Kirin 955 has higher clock speeds for both its high-performance and power-efficient cores. Ultimately, the choice between the two processors would depend on the specific requirements of the device or application they are intended for.
In terms of CPU cores and architecture, both processors have 8 cores. The Kirin 710F features a 4x 2.2 GHz Cortex-A73 and 4x 1.7 GHz Cortex-A53 architecture. On the other hand, the Kirin 955 has a 4x 2.5 GHz Cortex-A72 and 4x 1.8 GHz Cortex-A53 architecture. This means that the Kirin 955 has slightly higher clock speeds for both its high-performance and power-efficient cores, giving it an edge in terms of processing power.
When it comes to instruction sets, both processors support the ARMv8-A instruction set, which is commonly used in modern processors. Therefore, there is no significant difference between the two in this aspect.
In terms of lithography, the Kirin 710F is manufactured using a 12 nm process, while the Kirin 955 is manufactured using a slightly less advanced 16 nm process. A smaller lithography generally allows for better power efficiency and performance, which gives the Kirin 710F an advantage over the Kirin 955 in this regard.
The number of transistors in a processor can also impact its performance. The Kirin 710F has 5500 million transistors, whereas the Kirin 955 has 2000 million transistors. This indicates that the Kirin 710F has a higher transistor count, which can contribute to better performance and efficiency compared to the Kirin 955.
Lastly, both processors have the same thermal design power (TDP) of 5 Watts, suggesting that they consume a similar amount of power when operating at their maximum capacity.
In conclusion, the HiSilicon Kirin 710F offers better lithography, a higher number of transistors, and a comparable instruction set as compared to the Kirin 955. However, the Kirin 955 has higher clock speeds for both its high-performance and power-efficient cores. Ultimately, the choice between the two processors would depend on the specific requirements of the device or application they are intended for.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
4x 2.5 GHz – Cortex-A72 4x 1.8 GHz – Cortex-A53 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8-A |
Lithography | 12 nm | 16 nm |
Number of transistors | 5500 million | 2000 million |
TDP | 5 Watt | 5 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 4 GB |
Memory type | LPDDR4 | LPDDR4 |
Memory frequency | 1866 MHz | 1333 MHz |
Memory-bus | 2x32 bit | 2x32 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.0 |
Graphics
GPU name | Mali-G51 MP4 | Mali-T880 MP4 |
GPU Architecture | Bifrost | Midgard |
GPU frequency | 650 MHz | 900 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 4 |
Shaders | 64 | 64 |
DirectX | 12 | 11.2 |
OpenCL API | 2.0 | 1.2 |
Vulkan API | 1.0 | 1.0 |
Camera, Video, Display
Max screen resolution | 2340x1080 | |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 31MP, 2x 13MP |
Max Video Capture | FullHD@60fps | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.05 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 4.2 | 4.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2019 Quarter 1 | 2016 April |
Partnumber | Hi6260 | Hi3655 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Flagship |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Unisoc Tiger T700 vs Qualcomm Snapdragon 680
2
MediaTek Dimensity 1100 vs Samsung Exynos 2200
3
Samsung Exynos 1380 vs Qualcomm Snapdragon 8 Gen 2
4
MediaTek Dimensity 1000 vs Qualcomm Snapdragon 768G
5
MediaTek Dimensity 920 vs Qualcomm Snapdragon 730G
6
Unisoc Tiger T606 vs MediaTek Helio P35
7
Google Tensor G3 vs HiSilicon Kirin 9000 5G
8
Samsung Exynos 7884B vs Qualcomm Snapdragon 710
9
MediaTek Dimensity 930 vs MediaTek Helio P70
10
Unisoc SC9863A vs Qualcomm Snapdragon 778G