HiSilicon Kirin 710F vs HiSilicon Kirin 930

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The HiSilicon Kirin 710F and Kirin 930 are both processors but differ in their specifications. Let's take a closer look at each processor to compare their features.

Starting with the HiSilicon Kirin 710F, it utilizes a 12 nm lithography, which means it offers a more advanced manufacturing process, resulting in improved power efficiency and better performance. The CPU architecture consists of 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores, providing a balanced blend of high-performance and power-saving capabilities. With a total of 8 cores, this processor offers multi-tasking capabilities, allowing efficient handling of various computing tasks. Additionally, it is built on the ARMv8-A instruction set, providing compatibility with modern software and applications. The total number of transistors is 5500 million, indicating a high level of integration for improved performance. The power consumption, known as the TDP, is 5 Watts, indicating relatively low power usage.

On the other hand, the HiSilicon Kirin 930 has different specifications. It features a 28 nm lithography, which is less advanced compared to the Kirin 710F. This may result in comparatively lower power efficiency and lower overall performance. The CPU architecture of the Kirin 930 consists of 4x 2 GHz Cortex-A53 cores and 4x 1.5 GHz Cortex-A53 cores. While it still offers 8 cores like the Kirin 710F, the clock speeds are lower, which may affect its performance in more demanding tasks. Similar to the Kirin 710F, it also utilizes the ARMv8-A instruction set for software compatibility. However, the number of transistors is lower at 1000 million, implying less integration compared to the Kirin 710F. The power consumption of the Kirin 930 is also 5 Watts.

In summary, the HiSilicon Kirin 710F offers a more advanced manufacturing process, higher clock speeds for both high-performance and power-saving cores, a greater number of transistors, and a more power-efficient lithography. On the other hand, the Kirin 930 has a less advanced manufacturing process, lower clock speeds, fewer transistors, and a less power-efficient lithography. Choosing between these two processors would depend on the specific requirements of the device and the intended usage.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
4x 2 GHz – Cortex-A53
4x 1.5 GHz – Cortex-A53
Number of cores 8 8
Instruction Set ARMv8-A ARMv8-A
Lithography 12 nm 28 nm
Number of transistors 5500 million 1000 million
TDP 5 Watt 5 Watt

Memory (RAM)

Max amount up to 6 GB up to 6 GB
Memory type LPDDR4 LPDDR3
Memory frequency 1866 MHz 800 MHz
Memory-bus 2x32 bit 2x32 bit

Storage

Storage specification UFS 2.1 UFS 2.0

Graphics

GPU name Mali-G51 MP4 Mali-T628 MP4
GPU Architecture Bifrost Midgard
GPU frequency 650 MHz 600 MHz
GPU boost frequency 1000 MHz
Execution units 4 4
Shaders 64 64
DirectX 12 11
OpenCL API 2.0 1.2
Vulkan API 1.0 1.0

Camera, Video, Display

Max screen resolution 2340x1080 2560x1600
Max camera resolution 1x 48MP, 2x 24MP 1x 20MP
Max Video Capture 4K@30fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP8

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 0.3 Gbps
Peak Upload Speed 0.15 Gbps 0.05 Gbps
Wi-Fi 4 (802.11n) 5 (802.11ac)
Bluetooth 4.2 4.2
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS

Supplemental Information

Launch Date 2019 Quarter 1 2015 Quarter 2
Partnumber Hi6260 Hi3630
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 710F
195573
Kirin 930

GeekBench 6 Single-Core

Score
Kirin 710F
329
Kirin 930

GeekBench 6 Multi-Core

Score
Kirin 710F
1341
Kirin 930