HiSilicon Kirin 710F vs HiSilicon Kirin 9000 5G

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The HiSilicon Kirin 710F and HiSilicon Kirin 9000 5G are two processors manufactured by HiSilicon, a subsidiary of Huawei Technologies. Let's compare their specifications to understand their differences.

Starting with the HiSilicon Kirin 710F, it features an architecture with four Cortex-A73 cores clocked at 2.2 GHz and four Cortex-A53 cores running at 1.7 GHz. With a total of eight cores, this processor offers a balanced performance for everyday tasks. The Kirin 710F operates on an ARMv8-A instruction set and has a lithography of 12 nm. It has 5500 million transistors and a Thermal Design Power (TDP) of 5 watts.

On the other hand, the HiSilicon Kirin 9000 5G showcases a more advanced architecture. It includes one Cortex-A77 core clocked at 3.13 GHz, three Cortex-A77 cores running at 2.54 GHz, and four Cortex-A55 cores operating at 2.05 GHz. With the ARMv8.2-A instruction set, this processor is designed to provide exceptional performance. The Kirin 9000 5G operates on a 5 nm lithography, making it more power-efficient than the Kirin 710F. It packs a significantly higher number of transistors, with 15300 million, indicating a more advanced and powerful design. The TDP of the Kirin 9000 5G is slightly higher at 6 watts. Additionally, it features Neural Processing Units like Ascend Lite and Ascend Tiny for AI-related tasks and utilizes HUAWEI Da Vinci Architecture 2.0.

In summary, the HiSilicon Kirin 9000 5G outshines the Kirin 710F in terms of architecture, lithography, number of transistors, and AI capabilities. It offers higher clock speeds, advanced cores, and better power efficiency, making it suitable for demanding tasks such as gaming and multimedia. On the other hand, the Kirin 710F still presents a decent performance for day-to-day usage but might struggle with resource-intensive applications. Ultimately, the choice between these processors depends on the specific requirements and preferences of the user.

CPU cores and architecture

Architecture 4x 2.2 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
1x 3.13 GHz – Cortex-A77
3x 2.54 GHz – Cortex-A77
4x 2.05 GHz – Cortex-A55
Number of cores 8 8
Instruction Set ARMv8-A ARMv8.2-A
Lithography 12 nm 5 nm
Number of transistors 5500 million 15300 million
TDP 5 Watt 6 Watt
Neural Processing Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0

Memory (RAM)

Max amount up to 6 GB up to 16 GB
Memory type LPDDR4 LPDDR5
Memory frequency 1866 MHz 2750 MHz
Memory-bus 2x32 bit 4x16 bit

Storage

Storage specification UFS 2.1 UFS 3.1

Graphics

GPU name Mali-G51 MP4 Mali-G78 MP24
GPU Architecture Bifrost Valhall
GPU frequency 650 MHz 760 MHz
GPU boost frequency 1000 MHz
Execution units 4 24
Shaders 64 384
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 3840x2160
Max camera resolution 1x 48MP, 2x 24MP
Max Video Capture 4K@60fps
Video codec support H.264 (AVC)
H.265 (HEVC)
VP8
VP9
H.264 (AVC)
H.265 (HEVC)
VP8
VP9

Wireless

4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 4.6 Gbps
Peak Upload Speed 0.15 Gbps 2.5 Gbps
Wi-Fi 4 (802.11n) 6 (802.11ax)
Bluetooth 4.2 5.2
Satellite navigation BeiDou
GPS
GLONASS
BeiDou
GPS
Galileo
GLONASS
NavIC

Supplemental Information

Launch Date 2019 Quarter 1 2020 October
Partnumber Hi6260
Vertical Segment Mobiles Mobiles
Positioning Mid-end Flagship

AnTuTu 10

Total Score
Kirin 710F
195573
Kirin 9000 5G
762886

GeekBench 6 Single-Core

Score
Kirin 710F
329
Kirin 9000 5G
1062

GeekBench 6 Multi-Core

Score
Kirin 710F
1341
Kirin 9000 5G
3724