HiSilicon Kirin 710F vs HiSilicon Kirin 9000 5G
The HiSilicon Kirin 710F and HiSilicon Kirin 9000 5G are two processors manufactured by HiSilicon, a subsidiary of Huawei Technologies. Let's compare their specifications to understand their differences.
Starting with the HiSilicon Kirin 710F, it features an architecture with four Cortex-A73 cores clocked at 2.2 GHz and four Cortex-A53 cores running at 1.7 GHz. With a total of eight cores, this processor offers a balanced performance for everyday tasks. The Kirin 710F operates on an ARMv8-A instruction set and has a lithography of 12 nm. It has 5500 million transistors and a Thermal Design Power (TDP) of 5 watts.
On the other hand, the HiSilicon Kirin 9000 5G showcases a more advanced architecture. It includes one Cortex-A77 core clocked at 3.13 GHz, three Cortex-A77 cores running at 2.54 GHz, and four Cortex-A55 cores operating at 2.05 GHz. With the ARMv8.2-A instruction set, this processor is designed to provide exceptional performance. The Kirin 9000 5G operates on a 5 nm lithography, making it more power-efficient than the Kirin 710F. It packs a significantly higher number of transistors, with 15300 million, indicating a more advanced and powerful design. The TDP of the Kirin 9000 5G is slightly higher at 6 watts. Additionally, it features Neural Processing Units like Ascend Lite and Ascend Tiny for AI-related tasks and utilizes HUAWEI Da Vinci Architecture 2.0.
In summary, the HiSilicon Kirin 9000 5G outshines the Kirin 710F in terms of architecture, lithography, number of transistors, and AI capabilities. It offers higher clock speeds, advanced cores, and better power efficiency, making it suitable for demanding tasks such as gaming and multimedia. On the other hand, the Kirin 710F still presents a decent performance for day-to-day usage but might struggle with resource-intensive applications. Ultimately, the choice between these processors depends on the specific requirements and preferences of the user.
Starting with the HiSilicon Kirin 710F, it features an architecture with four Cortex-A73 cores clocked at 2.2 GHz and four Cortex-A53 cores running at 1.7 GHz. With a total of eight cores, this processor offers a balanced performance for everyday tasks. The Kirin 710F operates on an ARMv8-A instruction set and has a lithography of 12 nm. It has 5500 million transistors and a Thermal Design Power (TDP) of 5 watts.
On the other hand, the HiSilicon Kirin 9000 5G showcases a more advanced architecture. It includes one Cortex-A77 core clocked at 3.13 GHz, three Cortex-A77 cores running at 2.54 GHz, and four Cortex-A55 cores operating at 2.05 GHz. With the ARMv8.2-A instruction set, this processor is designed to provide exceptional performance. The Kirin 9000 5G operates on a 5 nm lithography, making it more power-efficient than the Kirin 710F. It packs a significantly higher number of transistors, with 15300 million, indicating a more advanced and powerful design. The TDP of the Kirin 9000 5G is slightly higher at 6 watts. Additionally, it features Neural Processing Units like Ascend Lite and Ascend Tiny for AI-related tasks and utilizes HUAWEI Da Vinci Architecture 2.0.
In summary, the HiSilicon Kirin 9000 5G outshines the Kirin 710F in terms of architecture, lithography, number of transistors, and AI capabilities. It offers higher clock speeds, advanced cores, and better power efficiency, making it suitable for demanding tasks such as gaming and multimedia. On the other hand, the Kirin 710F still presents a decent performance for day-to-day usage but might struggle with resource-intensive applications. Ultimately, the choice between these processors depends on the specific requirements and preferences of the user.
CPU cores and architecture
Architecture | 4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 12 nm | 5 nm |
Number of transistors | 5500 million | 15300 million |
TDP | 5 Watt | 6 Watt |
Neural Processing | Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 |
Memory (RAM)
Max amount | up to 6 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR5 |
Memory frequency | 1866 MHz | 2750 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G78 MP24 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 650 MHz | 760 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 24 |
Shaders | 64 | 384 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 3840x2160 |
Max camera resolution | 1x 48MP, 2x 24MP | |
Max Video Capture | 4K@60fps | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 4.6 Gbps |
Peak Upload Speed | 0.15 Gbps | 2.5 Gbps |
Wi-Fi | 4 (802.11n) | 6 (802.11ax) |
Bluetooth | 4.2 | 5.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC |
Supplemental Information
Launch Date | 2019 Quarter 1 | 2020 October |
Partnumber | Hi6260 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Flagship |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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