HiSilicon Kirin 710A vs Unisoc Tiger T710
VS
The HiSilicon Kirin 710A and the Unisoc Tiger T710 are both octa-core processors designed for smartphones. However, there are some key differences in their specifications.
Starting with the HiSilicon Kirin 710A, it features an architecture that consists of 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This combination offers a balanced performance for multitasking and energy efficiency. The processor's 14 nm lithography ensures better power efficiency by reducing energy leakage. With a TDP of 5 Watts, it can help prolong battery life.
On the other hand, the Unisoc Tiger T710 has an architecture that includes 4x 1.8 GHz Cortex-A75 cores and 4x 1.8 GHz Cortex-A55 cores. This configuration aims to provide a good blend of performance and power efficiency. The 12 nm lithography of this processor further improves power efficiency and heat dissipation. The Tiger T710 also boasts a dual NPU (Neural Processing Unit), which enhances AI capabilities, offering increased performance in tasks like image recognition and voice recognition.
In terms of instruction set, the HiSilicon Kirin 710A utilizes ARMv8-A, while the Unisoc Tiger T710 adopts ARMv8.2-A. This means that the latter processor supports more advanced features and technologies.
In summary, both the HiSilicon Kirin 710A and the Unisoc Tiger T710 have their own strengths. The Kirin 710A excels in power efficiency with its 14 nm lithography and lower TDP. Meanwhile, the Tiger T710 stands out with its dual NPU and ARMv8.2-A instruction set, offering enhanced AI capabilities and advanced features. Ultimately, the choice between these processors will depend on the specific needs and preferences of the device and its users.
Starting with the HiSilicon Kirin 710A, it features an architecture that consists of 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This combination offers a balanced performance for multitasking and energy efficiency. The processor's 14 nm lithography ensures better power efficiency by reducing energy leakage. With a TDP of 5 Watts, it can help prolong battery life.
On the other hand, the Unisoc Tiger T710 has an architecture that includes 4x 1.8 GHz Cortex-A75 cores and 4x 1.8 GHz Cortex-A55 cores. This configuration aims to provide a good blend of performance and power efficiency. The 12 nm lithography of this processor further improves power efficiency and heat dissipation. The Tiger T710 also boasts a dual NPU (Neural Processing Unit), which enhances AI capabilities, offering increased performance in tasks like image recognition and voice recognition.
In terms of instruction set, the HiSilicon Kirin 710A utilizes ARMv8-A, while the Unisoc Tiger T710 adopts ARMv8.2-A. This means that the latter processor supports more advanced features and technologies.
In summary, both the HiSilicon Kirin 710A and the Unisoc Tiger T710 have their own strengths. The Kirin 710A excels in power efficiency with its 14 nm lithography and lower TDP. Meanwhile, the Tiger T710 stands out with its dual NPU and ARMv8.2-A instruction set, offering enhanced AI capabilities and advanced features. Ultimately, the choice between these processors will depend on the specific needs and preferences of the device and its users.
CPU cores and architecture
| Architecture | 4x 2.0 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
4x 1.8 GHz – Cortex-A75 4x 1.8 GHz – Cortex-A55 |
| Number of cores | 8 | 8 |
| Instruction Set | ARMv8-A | ARMv8.2-A |
| Lithography | 14 nm | 12 nm |
| Number of transistors | 5500 million | |
| TDP | 5 Watt | |
| Neural Processing | Dual NPU |
Memory (RAM)
| Max amount | up to 6 GB | up to 8 GB |
| Memory type | LPDDR4 | LPDDR4X |
| Memory frequency | 1866 MHz | 1866 MHz |
| Memory-bus | 2x32 bit |
Storage
| Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
| GPU name | Mali-G51 MP4 | Imagination PowerVR GM9446 |
| GPU Architecture | Bifrost | Rogue |
| GPU frequency | 650 MHz | 800 MHz |
| GPU boost frequency | 1000 MHz | |
| Execution units | 4 | |
| Shaders | 64 | |
| DirectX | 12 | |
| OpenCL API | 2.0 | 4.0 |
| OpenGL API | ES 3.2 | |
| Vulkan API | 1.0 | 1.1 |
Camera, Video, Display
| Max screen resolution | 2340x1080 | |
| Max camera resolution | 1x 48MP, 2x 24MP | 1x 24MP |
| Max Video Capture | 4K@30fps | 4K@30fps |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
| 4G network | Yes | Yes |
| 5G network | Yes | Yes |
| Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
| Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
| Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
| Bluetooth | 5.1 | 5.0 |
| Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
| Launch Date | 2020 Quarter 4 | 2019 |
| Partnumber | Hi6260 | T710 |
| Vertical Segment | Mobiles | Mobiles |
| Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
Apple A11 Bionic vs Google Tensor G2
2
HiSilicon Kirin 935 vs MediaTek Dimensity 6080
3
Qualcomm Snapdragon 460 vs HiSilicon Kirin 710F
4
Samsung Exynos 1330 vs Samsung Exynos 1280
5
Samsung Exynos 7420 vs Qualcomm Snapdragon 782G
6
HiSilicon Kirin 990 5G vs MediaTek Dimensity 930
7
MediaTek Dimensity 7200 vs HiSilicon Kirin 970
8
Samsung Exynos 9611 vs Samsung Exynos 1380
9
MediaTek Dimensity 6100 Plus vs Qualcomm Snapdragon 660
10
MediaTek Helio P70 vs MediaTek Dimensity 1100