HiSilicon Kirin 710A vs Unisoc Tiger T612
The HiSilicon Kirin 710A and the Unisoc Tiger T612 are two processors that have their own unique specifications. Let's explore the differences between the two.
Starting with the CPU cores and architecture, the Kirin 710A features a combination of 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. On the other hand, the Tiger T612 combines 2x 1.8 GHz Cortex-A75 cores with 6x 1.8 GHz Cortex-A55 cores. It's worth noting that both processors have a total of 8 cores, but differ in their specific architecture.
Moving on to other specifications, the Kirin 710A operates on the ARMv8-A instruction set, while the Tiger T612 operates on the ARMv8.2-A instruction set. This indicates that the Tiger T612 may have some architectural enhancements and improvements over the Kirin 710A.
In terms of lithography, the Kirin 710A utilizes a 14 nm process, while the Tiger T612 employs a more advanced 12 nm process. This suggests that the Tiger T612 may have a slight edge in power efficiency and heat management.
Furthermore, when comparing the number of transistors, the Kirin 710A boasts 5500 million, while the exact number for the Tiger T612 is not specified. However, it is safe to assume that the Tiger T612 may have a similar number of transistors or potentially more given its improved lithography.
Lastly, there is a discrepancy in the thermal design power (TDP) between the two processors. The Kirin 710A has a TDP of 5 Watts, indicating low power consumption. On the other hand, the Tiger T612 has a slightly higher TDP of 10 Watts, implying a potentially higher power consumption.
In conclusion, the HiSilicon Kirin 710A and the Unisoc Tiger T612 processors display differences in CPU cores and architecture, instruction set, lithography, and TDP. While the Tiger T612 appears to have some advancements in terms of architecture and lithography, further benchmarks and real-world performance tests would be required to determine the overall superiority of one processor over the other.
Starting with the CPU cores and architecture, the Kirin 710A features a combination of 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. On the other hand, the Tiger T612 combines 2x 1.8 GHz Cortex-A75 cores with 6x 1.8 GHz Cortex-A55 cores. It's worth noting that both processors have a total of 8 cores, but differ in their specific architecture.
Moving on to other specifications, the Kirin 710A operates on the ARMv8-A instruction set, while the Tiger T612 operates on the ARMv8.2-A instruction set. This indicates that the Tiger T612 may have some architectural enhancements and improvements over the Kirin 710A.
In terms of lithography, the Kirin 710A utilizes a 14 nm process, while the Tiger T612 employs a more advanced 12 nm process. This suggests that the Tiger T612 may have a slight edge in power efficiency and heat management.
Furthermore, when comparing the number of transistors, the Kirin 710A boasts 5500 million, while the exact number for the Tiger T612 is not specified. However, it is safe to assume that the Tiger T612 may have a similar number of transistors or potentially more given its improved lithography.
Lastly, there is a discrepancy in the thermal design power (TDP) between the two processors. The Kirin 710A has a TDP of 5 Watts, indicating low power consumption. On the other hand, the Tiger T612 has a slightly higher TDP of 10 Watts, implying a potentially higher power consumption.
In conclusion, the HiSilicon Kirin 710A and the Unisoc Tiger T612 processors display differences in CPU cores and architecture, instruction set, lithography, and TDP. While the Tiger T612 appears to have some advancements in terms of architecture and lithography, further benchmarks and real-world performance tests would be required to determine the overall superiority of one processor over the other.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.0 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 1.8 GHz – Cortex-A75 6x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 14 nm | 12 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt | 10 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 8 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 1600 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G57 MP1 |
GPU Architecture | Mali Bifrost | Mali Valhall |
GPU frequency | 1000 MHz | 650 MHz |
Execution units | 4 | 1 |
Shaders | 64 | 16 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2400x1080 |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 50MP |
Max Video Capture | 4K@30fps | FullHD@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 Quarter 4 | 2022 January |
Partnumber | Hi6260 | T612 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
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