HiSilicon Kirin 710A vs Unisoc Tiger T606
When comparing the HiSilicon Kirin 710A and the Unisoc Tiger T606 processors, it's clear that they have some similarities and differences in their specifications.
Starting with the CPU cores and architecture, the HiSilicon Kirin 710A features 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. On the other hand, the Unisoc Tiger T606 has 2x 1.6 GHz Cortex-A75 cores and 6x 1.6 GHz Cortex-A55 cores. Both processors have 8 cores in total, but they differ in terms of architecture.
Moving on to the instruction set, the HiSilicon Kirin 710A utilizes the ARMv8-A instruction set, while the Unisoc Tiger T606 employs the ARMv8.2-A instruction set. This difference in instruction set might result in varying performance and capabilities between the two processors.
In terms of lithography, the HiSilicon Kirin 710A has a lithography of 14 nm, while the Unisoc Tiger T606 has a slightly smaller lithography of 12 nm. A smaller lithography can often lead to improved power efficiency and potentially better performance.
When comparing the number of transistors, the HiSilicon Kirin 710A boasts 5500 million transistors, whereas the Unisoc Tiger T606 does not specify its transistor count. However, it's worth noting that a higher number of transistors generally indicates a more complex and capable processor.
Lastly, when considering the TDP (Thermal Design Power), the HiSilicon Kirin 710A has a TDP of 5 Watts, while the Unisoc Tiger T606 has a slightly higher TDP of 10 Watts. The TDP is an important factor to consider, as it determines the maximum amount of heat that a processor can dissipate under normal operation.
Overall, both the HiSilicon Kirin 710A and Unisoc Tiger T606 processors have their own unique specifications that may appeal to different users. The HiSilicon Kirin 710A offers a higher transistor count, while the Unisoc Tiger T606 has a smaller lithography. Understanding these specifications can help users make informed decisions when selecting a processor for their specific needs.
Starting with the CPU cores and architecture, the HiSilicon Kirin 710A features 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. On the other hand, the Unisoc Tiger T606 has 2x 1.6 GHz Cortex-A75 cores and 6x 1.6 GHz Cortex-A55 cores. Both processors have 8 cores in total, but they differ in terms of architecture.
Moving on to the instruction set, the HiSilicon Kirin 710A utilizes the ARMv8-A instruction set, while the Unisoc Tiger T606 employs the ARMv8.2-A instruction set. This difference in instruction set might result in varying performance and capabilities between the two processors.
In terms of lithography, the HiSilicon Kirin 710A has a lithography of 14 nm, while the Unisoc Tiger T606 has a slightly smaller lithography of 12 nm. A smaller lithography can often lead to improved power efficiency and potentially better performance.
When comparing the number of transistors, the HiSilicon Kirin 710A boasts 5500 million transistors, whereas the Unisoc Tiger T606 does not specify its transistor count. However, it's worth noting that a higher number of transistors generally indicates a more complex and capable processor.
Lastly, when considering the TDP (Thermal Design Power), the HiSilicon Kirin 710A has a TDP of 5 Watts, while the Unisoc Tiger T606 has a slightly higher TDP of 10 Watts. The TDP is an important factor to consider, as it determines the maximum amount of heat that a processor can dissipate under normal operation.
Overall, both the HiSilicon Kirin 710A and Unisoc Tiger T606 processors have their own unique specifications that may appeal to different users. The HiSilicon Kirin 710A offers a higher transistor count, while the Unisoc Tiger T606 has a smaller lithography. Understanding these specifications can help users make informed decisions when selecting a processor for their specific needs.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 4x 2.0 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 1.6 GHz – Cortex-A75 6x 1.6 GHz – Cortex-A55 |
| Number of cores | 8 | 8 |
| Instruction Set | ARMv8-A | ARMv8.2-A |
| Lithography | 14 nm | 12 nm |
| Number of transistors | 5500 million | |
| TDP | 5 Watt | 10 Watt |
Memory (RAM)
| Max amount | up to 6 GB | up to 8 GB |
| Memory type | LPDDR4 | LPDDR4X |
| Memory frequency | 1866 MHz | 1600 MHz |
| Memory-bus | 2x32 bit | 2x16 bit |
Storage
| Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
| GPU name | Mali-G51 MP4 | Mali-G57 MP1 |
| GPU Architecture | Mali Bifrost | Mali Valhall |
| GPU frequency | 1000 MHz | 650 MHz |
| Execution units | 4 | 1 |
| Shaders | 64 | 16 |
| DirectX | 12 | 12 |
| OpenCL API | 2.0 | 2.1 |
| OpenGL API | ES 3.2 | |
| Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
| Max screen resolution | 2340x1080 | 1600x900@90Hz |
| Max camera resolution | 1x 48MP, 2x 24MP | 1x 24MP, 16MP + 8MP |
| Max Video Capture | 4K@30fps | FullHD@30fps |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
| 4G network | Yes | Yes |
| 5G network | Yes | Yes |
| Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
| Peak Upload Speed | 0.15 Gbps | 0.1 Gbps |
| Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
| Bluetooth | 5.1 | 5.0 |
| Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
| Launch Date | 2020 Quarter 4 | 2021 October |
| Partnumber | Hi6260 | T606 |
| Vertical Segment | Mobiles | Mobiles |
| Positioning | Mid-end | Low-end |
Popular comparisons:
1
Unisoc Tiger T612 vs Qualcomm Snapdragon 662
2
Apple M5 (iPad) vs Qualcomm Snapdragon 835
3
MediaTek Dimensity 9500 vs HiSilicon Kirin 9010
4
HiSilicon Kirin 9000S vs Unisoc Tanggula T770 5G
5
Apple A19 vs MediaTek Helio G92 Max
6
Qualcomm Snapdragon 678 vs Qualcomm Snapdragon 7s Gen 3
7
Unisoc T8300 vs Xiaomi Xring O1
8
Samsung Exynos 9609 vs Qualcomm Snapdragon 8 Plus Gen 1
9
Qualcomm Snapdragon 8 Gen 1 vs Qualcomm Snapdragon 7s Gen 4
10
HiSilicon Kirin 659 vs Qualcomm Snapdragon 8 Gen 2