HiSilicon Kirin 710A vs MediaTek Dimensity 930
When comparing the HiSilicon Kirin 710A and the MediaTek Dimensity 930 processors, several factors stand out.
In terms of CPU cores and architecture, the Kirin 710A features 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. It has a total of 8 cores, making it suitable for multitasking and handling multiple applications simultaneously. On the other hand, the Dimensity 930 has 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores, also totaling 8 cores. With the use of Cortex-A78 cores, the Dimensity 930 promises increased performance compared to the Kirin 710A.
The instruction set for the Kirin 710A is ARMv8-A, which enables efficient execution of commands. For the Dimensity 930, it uses ARMv8.2-A instruction set, further enhancing its capabilities in executing instructions.
In terms of lithography, the Kirin 710A has a 14 nm architecture. Although it may not be the most advanced technology, it still offers decent power efficiency. The Dimensity 930, on the other hand, employs a more advanced 6 nm lithography, indicating better power efficiency and potentially improved performance.
The TDP, or Thermal Design Power, is an important consideration. The Kirin 710A has a TDP of 5 Watts, which indicates its low power consumption. It is suitable for devices that prioritize battery life and energy efficiency. The Dimensity 930, on the other hand, has a TDP of 10 Watts. Although slightly higher, this is still a decent power consumption level considering the enhanced performance it offers.
Additionally, the Dimensity 930 boasts a Neural Processing Unit (NPU) which can greatly enhance AI capabilities. This allows for better processing of AI-related tasks and can improve the performance of AI-driven applications and features.
In summary, while the Kirin 710A offers a balanced combination of power efficiency and performance, the Dimensity 930 stands out with its more advanced architecture, lithography, and the inclusion of an NPU for AI-related tasks. These factors make the Dimensity 930 a compelling choice for those seeking top-notch processing power and efficiency.
In terms of CPU cores and architecture, the Kirin 710A features 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. It has a total of 8 cores, making it suitable for multitasking and handling multiple applications simultaneously. On the other hand, the Dimensity 930 has 2x 2.2 GHz Cortex-A78 cores and 6x 2.0 GHz Cortex-A55 cores, also totaling 8 cores. With the use of Cortex-A78 cores, the Dimensity 930 promises increased performance compared to the Kirin 710A.
The instruction set for the Kirin 710A is ARMv8-A, which enables efficient execution of commands. For the Dimensity 930, it uses ARMv8.2-A instruction set, further enhancing its capabilities in executing instructions.
In terms of lithography, the Kirin 710A has a 14 nm architecture. Although it may not be the most advanced technology, it still offers decent power efficiency. The Dimensity 930, on the other hand, employs a more advanced 6 nm lithography, indicating better power efficiency and potentially improved performance.
The TDP, or Thermal Design Power, is an important consideration. The Kirin 710A has a TDP of 5 Watts, which indicates its low power consumption. It is suitable for devices that prioritize battery life and energy efficiency. The Dimensity 930, on the other hand, has a TDP of 10 Watts. Although slightly higher, this is still a decent power consumption level considering the enhanced performance it offers.
Additionally, the Dimensity 930 boasts a Neural Processing Unit (NPU) which can greatly enhance AI capabilities. This allows for better processing of AI-related tasks and can improve the performance of AI-driven applications and features.
In summary, while the Kirin 710A offers a balanced combination of power efficiency and performance, the Dimensity 930 stands out with its more advanced architecture, lithography, and the inclusion of an NPU for AI-related tasks. These factors make the Dimensity 930 a compelling choice for those seeking top-notch processing power and efficiency.
CPU cores and architecture
Architecture | 4x 2.0 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 2.2 GHz – Cortex-A78 6x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 14 nm | 6 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR5 |
Memory frequency | 1866 MHz | 3200 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G51 MP4 | Imagination PowerVR BXM-8-256 |
GPU Architecture | Bifrost | Rogue |
GPU frequency | 650 MHz | 800 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | |
Shaders | 64 | |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 3.0 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2520x1080@120Hz |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 108MP, 1x 64MP |
Max Video Capture | 4K@30fps | 2K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2020 Quarter 4 | 2022 Quarter 3 |
Partnumber | Hi6260 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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