HiSilicon Kirin 710A vs MediaTek Dimensity 800
The HiSilicon Kirin 710A and MediaTek Dimensity 800 are two processors with different specifications.
Starting with the HiSilicon Kirin 710A, it features a CPU architecture consisting of 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. With a total of 8 cores, it offers a balanced combination of performance and power efficiency. The processor operates on the ARMv8-A instruction set and is built on a 14 nm lithography process. It has approximately 5,500 million transistors, indicating a decent level of complexity. The TDP, or thermal design power, is rated at 5 Watts, suggesting it requires relatively low power to operate efficiently.
On the other hand, the MediaTek Dimensity 800 boasts a CPU architecture consisting of 4x 2.0 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. With a total of 8 cores as well, it showcases a focus on performance. Similar to the Kirin 710A, it operates on the ARMv8.2-A instruction set. However, the Dimensity 800 has a smaller lithography process at 7 nm, which typically offers better power efficiency and performance gains. The TDP for the Dimensity 800 is rated at 10 Watts, indicating slightly higher power consumption compared to the Kirin 710A. Additionally, the Dimensity 800 incorporates a Neural Processing Unit (NPU), which enhances its capability in performing AI-related tasks.
In summary, while both processors offer a combination of high performance and power efficiency, they differ in various aspects. The HiSilicon Kirin 710A has a larger number of cores and a lower TDP, which may make it more suitable for power-constrained applications. On the other hand, the MediaTek Dimensity 800 showcases a smaller lithography process, a slightly higher TDP, and incorporates an NPU, making it a potentially better choice for tasks involving AI and machine learning. Ultimately, the choice between these two processors would depend on the specific requirements and priorities of the intended application.
Starting with the HiSilicon Kirin 710A, it features a CPU architecture consisting of 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. With a total of 8 cores, it offers a balanced combination of performance and power efficiency. The processor operates on the ARMv8-A instruction set and is built on a 14 nm lithography process. It has approximately 5,500 million transistors, indicating a decent level of complexity. The TDP, or thermal design power, is rated at 5 Watts, suggesting it requires relatively low power to operate efficiently.
On the other hand, the MediaTek Dimensity 800 boasts a CPU architecture consisting of 4x 2.0 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. With a total of 8 cores as well, it showcases a focus on performance. Similar to the Kirin 710A, it operates on the ARMv8.2-A instruction set. However, the Dimensity 800 has a smaller lithography process at 7 nm, which typically offers better power efficiency and performance gains. The TDP for the Dimensity 800 is rated at 10 Watts, indicating slightly higher power consumption compared to the Kirin 710A. Additionally, the Dimensity 800 incorporates a Neural Processing Unit (NPU), which enhances its capability in performing AI-related tasks.
In summary, while both processors offer a combination of high performance and power efficiency, they differ in various aspects. The HiSilicon Kirin 710A has a larger number of cores and a lower TDP, which may make it more suitable for power-constrained applications. On the other hand, the MediaTek Dimensity 800 showcases a smaller lithography process, a slightly higher TDP, and incorporates an NPU, making it a potentially better choice for tasks involving AI and machine learning. Ultimately, the choice between these two processors would depend on the specific requirements and priorities of the intended application.
CPU cores and architecture
Architecture | 4x 2.0 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
4x 2.0 GHz – Cortex-A76 4x 2.0 GHz – Cortex-A55 |
Number of cores | 8 | 4 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 14 nm | 7 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G57 MP4 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 650 MHz | 650 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 4 |
Shaders | 64 | 64 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2520x1080@120Hz |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 80MP, 1x 32MP + 1x 16MP |
Max Video Capture | 4K@30fps | 4K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS QZSS |
Supplemental Information
Launch Date | 2020 Quarter 4 | 2020 Quarter 2 |
Partnumber | Hi6260 | MT6873, MT6873V |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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