HiSilicon Kirin 710A vs MediaTek Dimensity 800

The HiSilicon Kirin 710A and MediaTek Dimensity 800 are two processors with different specifications.

Starting with the HiSilicon Kirin 710A, it features a CPU architecture consisting of 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. With a total of 8 cores, it offers a balanced combination of performance and power efficiency. The processor operates on the ARMv8-A instruction set and is built on a 14 nm lithography process. It has approximately 5,500 million transistors, indicating a decent level of complexity. The TDP, or thermal design power, is rated at 5 Watts, suggesting it requires relatively low power to operate efficiently.

On the other hand, the MediaTek Dimensity 800 boasts a CPU architecture consisting of 4x 2.0 GHz Cortex-A76 cores and 4x 2.0 GHz Cortex-A55 cores. With a total of 8 cores as well, it showcases a focus on performance. Similar to the Kirin 710A, it operates on the ARMv8.2-A instruction set. However, the Dimensity 800 has a smaller lithography process at 7 nm, which typically offers better power efficiency and performance gains. The TDP for the Dimensity 800 is rated at 10 Watts, indicating slightly higher power consumption compared to the Kirin 710A. Additionally, the Dimensity 800 incorporates a Neural Processing Unit (NPU), which enhances its capability in performing AI-related tasks.

In summary, while both processors offer a combination of high performance and power efficiency, they differ in various aspects. The HiSilicon Kirin 710A has a larger number of cores and a lower TDP, which may make it more suitable for power-constrained applications. On the other hand, the MediaTek Dimensity 800 showcases a smaller lithography process, a slightly higher TDP, and incorporates an NPU, making it a potentially better choice for tasks involving AI and machine learning. Ultimately, the choice between these two processors would depend on the specific requirements and priorities of the intended application.

CPU cores and architecture

Architecture 4x 2.0 GHz – Cortex-A73
4x 1.7 GHz – Cortex-A53
4x 2.0 GHz – Cortex-A76
4x 2.0 GHz – Cortex-A55
Number of cores 8 4
Instruction Set ARMv8-A ARMv8.2-A
Lithography 14 nm 7 nm
Number of transistors 5500 million
TDP 5 Watt 10 Watt
Neural Processing NPU

Memory (RAM)

Max amount up to 6 GB up to 16 GB
Memory type LPDDR4 LPDDR4X
Memory frequency 1866 MHz 2133 MHz
Memory-bus 2x32 bit 2x16 bit


Storage specification UFS 2.1 UFS 2.2


GPU name Mali-G51 MP4 Mali-G57 MP4
GPU Architecture Bifrost Valhall
GPU frequency 650 MHz 650 MHz
GPU boost frequency 1000 MHz
Execution units 4 4
Shaders 64 64
DirectX 12 12
OpenCL API 2.0 2.1
OpenGL API ES 3.2
Vulkan API 1.0 1.2

Camera, Video, Display

Max screen resolution 2340x1080 2520x1080@120Hz
Max camera resolution 1x 48MP, 2x 24MP 1x 80MP, 1x 32MP + 1x 16MP
Max Video Capture 4K@30fps 4K@30FPS
Video codec support H.264 (AVC)
H.265 (HEVC)
H.264 (AVC)
H.265 (HEVC)


4G network Yes Yes
5G network Yes Yes
Peak Download Speed 0.6 Gbps 2.77 Gbps
Peak Upload Speed 0.15 Gbps 1.2 Gbps
Wi-Fi 4 (802.11n) 5 (802.11ac)
Bluetooth 5.1 5.1
Satellite navigation BeiDou

Supplemental Information

Launch Date 2020 Quarter 4 2020 Quarter 2
Partnumber Hi6260 MT6873, MT6873V
Vertical Segment Mobiles Mobiles
Positioning Mid-end Mid-end

AnTuTu 10

Total Score
Kirin 710A
Dimensity 800

GeekBench 6 Single-Core

Kirin 710A
Dimensity 800

GeekBench 6 Multi-Core

Kirin 710A
Dimensity 800