HiSilicon Kirin 710A vs MediaTek Dimensity 720
The HiSilicon Kirin 710A and the MediaTek Dimensity 720 are two processors with distinct specifications and capabilities.
Starting with the HiSilicon Kirin 710A, it features a total of eight cores, consisting of four Cortex-A73 cores clocked at 2.0 GHz and four Cortex-A53 cores running at 1.7 GHz. With an ARMv8-A instruction set, the Kirin 710A is built on a 14 nm lithography process and contains 5500 million transistors. It has a thermal design power (TDP) of 5 Watts. These specifications make it a suitable option for devices that require a balance between performance and power efficiency.
On the other hand, the MediaTek Dimensity 720 offers a different architecture. It includes two Cortex-A76 cores that operate at 2.2 GHz and six Cortex-A55 cores running at 2 GHz. With a total of eight cores and an ARMv8.2-A instruction set, the Dimensity 720 is built using a more advanced 7 nm lithography process, which allows for better power efficiency and overall performance. It has a slightly higher TDP of 10 Watts and also includes a Neural Processing Unit (NPU), which enhances its capabilities in machine learning and artificial intelligence tasks.
In summary, both processors have their strengths and target different use cases. The HiSilicon Kirin 710A is designed for devices that prioritize power efficiency while delivering decent performance. On the other hand, the MediaTek Dimensity 720 excels in terms of power efficiency and performance, thanks to its 7 nm lithography process and inclusion of an NPU. The choice between the two processors would depend on specific requirements and priorities, such as power consumption, performance demands, and the need for specific AI capabilities.
Starting with the HiSilicon Kirin 710A, it features a total of eight cores, consisting of four Cortex-A73 cores clocked at 2.0 GHz and four Cortex-A53 cores running at 1.7 GHz. With an ARMv8-A instruction set, the Kirin 710A is built on a 14 nm lithography process and contains 5500 million transistors. It has a thermal design power (TDP) of 5 Watts. These specifications make it a suitable option for devices that require a balance between performance and power efficiency.
On the other hand, the MediaTek Dimensity 720 offers a different architecture. It includes two Cortex-A76 cores that operate at 2.2 GHz and six Cortex-A55 cores running at 2 GHz. With a total of eight cores and an ARMv8.2-A instruction set, the Dimensity 720 is built using a more advanced 7 nm lithography process, which allows for better power efficiency and overall performance. It has a slightly higher TDP of 10 Watts and also includes a Neural Processing Unit (NPU), which enhances its capabilities in machine learning and artificial intelligence tasks.
In summary, both processors have their strengths and target different use cases. The HiSilicon Kirin 710A is designed for devices that prioritize power efficiency while delivering decent performance. On the other hand, the MediaTek Dimensity 720 excels in terms of power efficiency and performance, thanks to its 7 nm lithography process and inclusion of an NPU. The choice between the two processors would depend on specific requirements and priorities, such as power consumption, performance demands, and the need for specific AI capabilities.
CPU cores and architecture
Architecture | 4x 2.0 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 2.2 GHz – Cortex-A76 6x 2 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 14 nm | 7 nm |
Number of transistors | 5500 million | |
TDP | 5 Watt | 10 Watt |
Neural Processing | NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 12 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 2x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.2 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G57 MP3 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 650 MHz | 850 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 3 |
Shaders | 64 | |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2520x1080@90Hz |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 64MP, 1x 20MP + 1x 16MP |
Max Video Capture | 4K@30fps | 4K@30FPS |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 2.77 Gbps |
Peak Upload Speed | 0.15 Gbps | 1.2 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 5.1 | 5.1 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC QZSS |
Supplemental Information
Launch Date | 2020 Quarter 4 | 2020 Quarter 3 |
Partnumber | Hi6260 | MT6853V/ZA, MT6853V/NZA |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
MediaTek Helio P95 vs Qualcomm Snapdragon 8 Plus Gen 1
2
Samsung Exynos 2100 vs Unisoc Tiger T618
3
Qualcomm Snapdragon 680 vs MediaTek Helio G35
4
HiSilicon Kirin 9000 5G vs HiSilicon Kirin 9000E 5G
5
Qualcomm Snapdragon 732G vs MediaTek Dimensity 800
6
Qualcomm Snapdragon 750G vs HiSilicon Kirin 990 4G
7
Unisoc Tiger T612 vs Samsung Exynos 9825
8
Apple A13 Bionic vs MediaTek Dimensity 9000
9
MediaTek Dimensity 900 vs Qualcomm Snapdragon 460
10
HiSilicon Kirin 810 vs Qualcomm Snapdragon 480