HiSilicon Kirin 710A vs HiSilicon Kirin 980
The HiSilicon Kirin 710A and HiSilicon Kirin 980 are both powerful processors, but they do have some notable differences in their specifications.
Starting with the HiSilicon Kirin 710A, it features an architecture composed of 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This 8-core processor operates on an ARMv8-A instruction set and is built on a 14 nm lithography process. With 5500 million transistors, it offers a good balance between performance and power efficiency. The TDP (Thermal Design Power) for the Kirin 710A is 5 Watt.
On the other hand, the HiSilicon Kirin 980 boasts a more advanced architecture. It combines 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. Again, this is an 8-core processor with support for the ARMv8-A instruction set. The Kirin 980 is manufactured using a more advanced 7 nm lithography process and incorporates 6900 million transistors. With a TDP of 6 Watt, it offers slightly higher performance while maintaining energy efficiency. Additionally, it includes the HiSilicon Dual NPU for neural processing.
In terms of performance, the Kirin 980 is likely to outperform the Kirin 710A due to its more advanced architecture and smaller lithography process. The additional A76 cores in the Kirin 980 provide a performance boost for demanding tasks, while the A55 cores help optimize power consumption for less intensive operations. The inclusion of the Dual NPU in the Kirin 980 also allows for improved AI processing capabilities.
Overall, while the HiSilicon Kirin 710A is a capable processor suitable for many everyday tasks, the Kirin 980 offers a higher level of performance and efficiency. Whether it is for gaming, multitasking, or AI-related tasks, the Kirin 980 is likely to deliver a more satisfying user experience. However, it is essential to consider that these processors are designed for different device segments, and individual performance can also vary based on additional factors, such as cooling and software optimization.
Starting with the HiSilicon Kirin 710A, it features an architecture composed of 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This 8-core processor operates on an ARMv8-A instruction set and is built on a 14 nm lithography process. With 5500 million transistors, it offers a good balance between performance and power efficiency. The TDP (Thermal Design Power) for the Kirin 710A is 5 Watt.
On the other hand, the HiSilicon Kirin 980 boasts a more advanced architecture. It combines 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. Again, this is an 8-core processor with support for the ARMv8-A instruction set. The Kirin 980 is manufactured using a more advanced 7 nm lithography process and incorporates 6900 million transistors. With a TDP of 6 Watt, it offers slightly higher performance while maintaining energy efficiency. Additionally, it includes the HiSilicon Dual NPU for neural processing.
In terms of performance, the Kirin 980 is likely to outperform the Kirin 710A due to its more advanced architecture and smaller lithography process. The additional A76 cores in the Kirin 980 provide a performance boost for demanding tasks, while the A55 cores help optimize power consumption for less intensive operations. The inclusion of the Dual NPU in the Kirin 980 also allows for improved AI processing capabilities.
Overall, while the HiSilicon Kirin 710A is a capable processor suitable for many everyday tasks, the Kirin 980 offers a higher level of performance and efficiency. Whether it is for gaming, multitasking, or AI-related tasks, the Kirin 980 is likely to deliver a more satisfying user experience. However, it is essential to consider that these processors are designed for different device segments, and individual performance can also vary based on additional factors, such as cooling and software optimization.
CPU cores and architecture
Architecture | 4x 2.0 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 2.6 GHz – Cortex-A76 2x 1.92 GHz – Cortex-A76 4x 1.8 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8-A |
Lithography | 14 nm | 7 nm |
Number of transistors | 5500 million | 6900 million |
TDP | 5 Watt | 6 Watt |
Neural Processing | HiSilicon Dual NPU |
Memory (RAM)
Max amount | up to 6 GB | up to 8 GB |
Memory type | LPDDR4 | LPDDR4X |
Memory frequency | 1866 MHz | 2133 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G76 MP10 |
GPU Architecture | Bifrost | Bifrost |
GPU frequency | 650 MHz | 720 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 10 |
Shaders | 64 | 160 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 3120x1440 |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 48MP, 2x 32MP |
Max Video Capture | 4K@30fps | 4K@30fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 1.4 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.2 Gbps |
Wi-Fi | 4 (802.11n) | 6 (802.11ax) |
Bluetooth | 5.1 | 5.0 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 Quarter 4 | 2018 Quarter 4 |
Partnumber | Hi6260 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Flagship |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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