HiSilicon Kirin 710A vs HiSilicon Kirin 980
The HiSilicon Kirin 710A and HiSilicon Kirin 980 are both powerful processors, but they do have some notable differences in their specifications.
Starting with the HiSilicon Kirin 710A, it features an architecture composed of 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This 8-core processor operates on an ARMv8-A instruction set and is built on a 14 nm lithography process. With 5500 million transistors, it offers a good balance between performance and power efficiency. The TDP (Thermal Design Power) for the Kirin 710A is 5 Watt.
On the other hand, the HiSilicon Kirin 980 boasts a more advanced architecture. It combines 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. Again, this is an 8-core processor with support for the ARMv8-A instruction set. The Kirin 980 is manufactured using a more advanced 7 nm lithography process and incorporates 6900 million transistors. With a TDP of 6 Watt, it offers slightly higher performance while maintaining energy efficiency. Additionally, it includes the HiSilicon Dual NPU for neural processing.
In terms of performance, the Kirin 980 is likely to outperform the Kirin 710A due to its more advanced architecture and smaller lithography process. The additional A76 cores in the Kirin 980 provide a performance boost for demanding tasks, while the A55 cores help optimize power consumption for less intensive operations. The inclusion of the Dual NPU in the Kirin 980 also allows for improved AI processing capabilities.
Overall, while the HiSilicon Kirin 710A is a capable processor suitable for many everyday tasks, the Kirin 980 offers a higher level of performance and efficiency. Whether it is for gaming, multitasking, or AI-related tasks, the Kirin 980 is likely to deliver a more satisfying user experience. However, it is essential to consider that these processors are designed for different device segments, and individual performance can also vary based on additional factors, such as cooling and software optimization.
Starting with the HiSilicon Kirin 710A, it features an architecture composed of 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. This 8-core processor operates on an ARMv8-A instruction set and is built on a 14 nm lithography process. With 5500 million transistors, it offers a good balance between performance and power efficiency. The TDP (Thermal Design Power) for the Kirin 710A is 5 Watt.
On the other hand, the HiSilicon Kirin 980 boasts a more advanced architecture. It combines 2x 2.6 GHz Cortex-A76 cores, 2x 1.92 GHz Cortex-A76 cores, and 4x 1.8 GHz Cortex-A55 cores. Again, this is an 8-core processor with support for the ARMv8-A instruction set. The Kirin 980 is manufactured using a more advanced 7 nm lithography process and incorporates 6900 million transistors. With a TDP of 6 Watt, it offers slightly higher performance while maintaining energy efficiency. Additionally, it includes the HiSilicon Dual NPU for neural processing.
In terms of performance, the Kirin 980 is likely to outperform the Kirin 710A due to its more advanced architecture and smaller lithography process. The additional A76 cores in the Kirin 980 provide a performance boost for demanding tasks, while the A55 cores help optimize power consumption for less intensive operations. The inclusion of the Dual NPU in the Kirin 980 also allows for improved AI processing capabilities.
Overall, while the HiSilicon Kirin 710A is a capable processor suitable for many everyday tasks, the Kirin 980 offers a higher level of performance and efficiency. Whether it is for gaming, multitasking, or AI-related tasks, the Kirin 980 is likely to deliver a more satisfying user experience. However, it is essential to consider that these processors are designed for different device segments, and individual performance can also vary based on additional factors, such as cooling and software optimization.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
| Architecture | 4x 2.0 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
2x 2.6 GHz – Cortex-A76 2x 1.92 GHz – Cortex-A76 4x 1.8 GHz – Cortex-A55 |
| Number of cores | 8 | 8 |
| Instruction Set | ARMv8-A | ARMv8-A |
| Lithography | 14 nm | 7 nm |
| Number of transistors | 5500 million | 6900 million |
| TDP | 5 Watt | 6 Watt |
| Neural Processing | HiSilicon Dual NPU |
Memory (RAM)
| Max amount | up to 6 GB | up to 8 GB |
| Memory type | LPDDR4 | LPDDR4X |
| Memory frequency | 1866 MHz | 2133 MHz |
| Memory-bus | 2x32 bit | 4x16 bit |
Storage
| Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
| GPU name | Mali-G51 MP4 | Mali-G76 MP10 |
| GPU Architecture | Mali Bifrost | Mali Bifrost |
| GPU frequency | 1000 MHz | 720 MHz |
| Execution units | 4 | 10 |
| Shaders | 64 | 160 |
| DirectX | 12 | 12 |
| OpenCL API | 2.0 | 2.1 |
| OpenGL API | ES 3.2 | |
| Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
| Max screen resolution | 2340x1080 | 3120x1440 |
| Max camera resolution | 1x 48MP, 2x 24MP | 1x 48MP, 2x 32MP |
| Max Video Capture | 4K@30fps | 4K@30fps |
| Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
AV1 H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
| 4G network | Yes | Yes |
| 5G network | Yes | Yes |
| Peak Download Speed | 0.6 Gbps | 1.4 Gbps |
| Peak Upload Speed | 0.15 Gbps | 0.2 Gbps |
| Wi-Fi | 4 (802.11n) | 6 (802.11ax) |
| Bluetooth | 5.1 | 5.0 |
| Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
| Launch Date | 2020 Quarter 4 | 2018 Quarter 4 |
| Partnumber | Hi6260 | |
| Vertical Segment | Mobiles | Mobiles |
| Positioning | Mid-end | Flagship |
Popular comparisons:
1
Qualcomm Snapdragon 425 vs MediaTek Dimensity 7200
2
Qualcomm Snapdragon 6 Gen 3 vs MediaTek Helio P35
3
MediaTek Dimensity 1050 vs MediaTek Dimensity 8400
4
Qualcomm Snapdragon 821 vs Samsung Exynos 2600
5
MediaTek Dimensity 700 vs Qualcomm Snapdragon 7s Gen 2
6
MediaTek Helio G95 vs MediaTek Dimensity 1000
7
Samsung Exynos 2400e vs MediaTek Helio P60
8
Samsung Exynos 9810 vs Apple M5 (iPad)
9
Qualcomm Snapdragon 625 vs MediaTek Dimensity 1080
10
MediaTek Helio G99 vs HiSilicon Kirin 985 5G