HiSilicon Kirin 710A vs HiSilicon Kirin 950
The HiSilicon Kirin 710A and HiSilicon Kirin 950 are two processors that offer different specifications and features.
Starting with the HiSilicon Kirin 710A, this processor features an architecture consisting of 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. It boasts a total of 8 cores, providing efficient multitasking capabilities. The instruction set supported by this processor is ARMv8-A, ensuring compatibility with a wide range of software. With a lithography of 14 nm, the Kirin 710A offers good power efficiency, making it suitable for smartphones and other mobile devices. It also has a total of 5500 million transistors, enabling faster processing and execution of tasks. Additionally, the TDP (Thermal Design Power) for this processor is at 5 Watts, allowing for optimal power management.
On the other hand, the HiSilicon Kirin 950 offers a slightly different setup. It features an architecture consisting of 4x 2.4 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores. Like the Kirin 710A, it also supports the ARMv8-A instruction set and has a total of 8 cores. However, the Kirin 950 has a larger lithography of 16 nm. While this may result in slightly lower power efficiency compared to the Kirin 710A, it still provides good performance. The Kirin 950 houses 2000 million transistors, which is less compared to the Kirin 710A. Nevertheless, it still delivers efficient processing capabilities. Lastly, the TDP for the Kirin 950 is also at 5 Watts, ensuring that it operates within an optimal power range.
In summary, both the HiSilicon Kirin 710A and Kirin 950 offer strong performance and efficient power management. While the Kirin 710A has a smaller lithography and a greater number of transistors, the Kirin 950 boasts higher clock speeds for its cores. The choice between these processors would depend on the specific requirements and preferences of the user, such as power efficiency or processing speed. Ultimately, both processors provide solid options for various mobile devices.
Starting with the HiSilicon Kirin 710A, this processor features an architecture consisting of 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. It boasts a total of 8 cores, providing efficient multitasking capabilities. The instruction set supported by this processor is ARMv8-A, ensuring compatibility with a wide range of software. With a lithography of 14 nm, the Kirin 710A offers good power efficiency, making it suitable for smartphones and other mobile devices. It also has a total of 5500 million transistors, enabling faster processing and execution of tasks. Additionally, the TDP (Thermal Design Power) for this processor is at 5 Watts, allowing for optimal power management.
On the other hand, the HiSilicon Kirin 950 offers a slightly different setup. It features an architecture consisting of 4x 2.4 GHz Cortex-A72 cores and 4x 1.8 GHz Cortex-A53 cores. Like the Kirin 710A, it also supports the ARMv8-A instruction set and has a total of 8 cores. However, the Kirin 950 has a larger lithography of 16 nm. While this may result in slightly lower power efficiency compared to the Kirin 710A, it still provides good performance. The Kirin 950 houses 2000 million transistors, which is less compared to the Kirin 710A. Nevertheless, it still delivers efficient processing capabilities. Lastly, the TDP for the Kirin 950 is also at 5 Watts, ensuring that it operates within an optimal power range.
In summary, both the HiSilicon Kirin 710A and Kirin 950 offer strong performance and efficient power management. While the Kirin 710A has a smaller lithography and a greater number of transistors, the Kirin 950 boasts higher clock speeds for its cores. The choice between these processors would depend on the specific requirements and preferences of the user, such as power efficiency or processing speed. Ultimately, both processors provide solid options for various mobile devices.
CPU cores and architecture
Architecture | 4x 2.0 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
4x 2.4 GHz – Cortex-A72 4x 1.8 GHz – Cortex-A53 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8-A |
Lithography | 14 nm | 16 nm |
Number of transistors | 5500 million | 2000 million |
TDP | 5 Watt | 5 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 4 GB |
Memory type | LPDDR4 | LPDDR4 |
Memory frequency | 1866 MHz | 1333 MHz |
Memory-bus | 2x32 bit | 2x32 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.0 |
Graphics
GPU name | Mali-G51 MP4 | Mali-T880 MP4 |
GPU Architecture | Bifrost | Midgard |
GPU frequency | 650 MHz | 900 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 4 |
Shaders | 64 | 64 |
DirectX | 12 | 11.2 |
OpenCL API | 2.0 | 1.2 |
Vulkan API | 1.0 | 1.0 |
Camera, Video, Display
Max screen resolution | 2340x1080 | |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 31MP, 2x 13MP |
Max Video Capture | 4K@30fps | FullHD@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.3 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.05 Gbps |
Wi-Fi | 4 (802.11n) | 5 (802.11ac) |
Bluetooth | 5.1 | 4.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS |
Supplemental Information
Launch Date | 2020 Quarter 4 | 2015 November |
Partnumber | Hi6260 | Hi3650 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Flagship |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
Popular comparisons:
1
MediaTek Helio G96 vs MediaTek Dimensity 1050
2
MediaTek Dimensity 810 vs HiSilicon Kirin 970
3
Unisoc Tiger T310 vs MediaTek Dimensity 700
4
Qualcomm Snapdragon 865 Plus vs HiSilicon Kirin 990 4G
5
Qualcomm Snapdragon 720G vs Samsung Exynos 2100
6
Samsung Exynos 990 vs MediaTek Dimensity 800U
7
Qualcomm Snapdragon 710 vs Unisoc SC9832E
8
Qualcomm Snapdragon 460 vs MediaTek Dimensity 930
9
HiSilicon Kirin 955 vs Samsung Exynos 7904
10
Qualcomm Snapdragon 855 vs Samsung Exynos 850