HiSilicon Kirin 710A vs HiSilicon Kirin 9000E 5G
The HiSilicon Kirin 710A and HiSilicon Kirin 9000E 5G are two processors that offer different specifications and features. Let's compare them based on their specifications.
Starting with the HiSilicon Kirin 710A, it features a total of 8 CPU cores, divided into 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. The architecture of this processor is ARMv8-A, and it operates on a 14 nm lithography process. With a total of 5500 million transistors, it offers a TDP of 5 Watts. These specifications indicate that the Kirin 710A is a mid-range processor designed to provide decent performance while being power-efficient.
On the other hand, the HiSilicon Kirin 9000E 5G comes with more advanced specifications. It also features 8 CPU cores but with a different architecture. It includes 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. The instruction set is ARMv8.2-A, and it operates on a more advanced 5 nm lithography. With a significantly higher number of transistors at 15300 million, the Kirin 9000E 5G offers a TDP of 6 Watts. Additionally, it includes Neural Processing with Ascend Lite + Ascend Tiny and the advanced HUAWEI Da Vinci Architecture 2.0, indicating that it is intended for high-performance and advanced AI capabilities.
In comparison, the Kirin 9000E 5G outshines the Kirin 710A in terms of performance and advanced features. With a faster clock speed, improved architecture, smaller lithography, and more transistors, the Kirin 9000E 5G is expected to deliver superior processing power, faster multitasking, and better AI performance. However, it should be noted that these improvements might also result in higher power consumption.
Overall, the HiSilicon Kirin 9000E 5G stands as a flagship processor designed for high-end smartphones, while the Kirin 710A is a more budget-friendly option suitable for mid-range devices. The choice between the two processors ultimately depends on the intended usage, performance needs, and budgetary constraints.
Starting with the HiSilicon Kirin 710A, it features a total of 8 CPU cores, divided into 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. The architecture of this processor is ARMv8-A, and it operates on a 14 nm lithography process. With a total of 5500 million transistors, it offers a TDP of 5 Watts. These specifications indicate that the Kirin 710A is a mid-range processor designed to provide decent performance while being power-efficient.
On the other hand, the HiSilicon Kirin 9000E 5G comes with more advanced specifications. It also features 8 CPU cores but with a different architecture. It includes 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. The instruction set is ARMv8.2-A, and it operates on a more advanced 5 nm lithography. With a significantly higher number of transistors at 15300 million, the Kirin 9000E 5G offers a TDP of 6 Watts. Additionally, it includes Neural Processing with Ascend Lite + Ascend Tiny and the advanced HUAWEI Da Vinci Architecture 2.0, indicating that it is intended for high-performance and advanced AI capabilities.
In comparison, the Kirin 9000E 5G outshines the Kirin 710A in terms of performance and advanced features. With a faster clock speed, improved architecture, smaller lithography, and more transistors, the Kirin 9000E 5G is expected to deliver superior processing power, faster multitasking, and better AI performance. However, it should be noted that these improvements might also result in higher power consumption.
Overall, the HiSilicon Kirin 9000E 5G stands as a flagship processor designed for high-end smartphones, while the Kirin 710A is a more budget-friendly option suitable for mid-range devices. The choice between the two processors ultimately depends on the intended usage, performance needs, and budgetary constraints.
CPU cores and architecture
Architecture | 4x 2.0 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 14 nm | 5 nm |
Number of transistors | 5500 million | 15300 million |
TDP | 5 Watt | 6 Watt |
Neural Processing | Ascend Lite + Ascend Tiny, HUAWEI Da Vinci Architecture 2.0 |
Memory (RAM)
Max amount | up to 6 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR5 |
Memory frequency | 1866 MHz | 2750 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G78 MP22 |
GPU Architecture | Bifrost | Valhall |
GPU frequency | 650 MHz | 760 MHz |
GPU boost frequency | 1000 MHz | |
Execution units | 4 | 22 |
Shaders | 64 | 352 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 3840x2160 |
Max camera resolution | 1x 48MP, 2x 24MP | |
Max Video Capture | 4K@30fps | 4K@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 4.6 Gbps |
Peak Upload Speed | 0.15 Gbps | 2.5 Gbps |
Wi-Fi | 4 (802.11n) | 6 (802.11ax) |
Bluetooth | 5.1 | 5.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC |
Supplemental Information
Launch Date | 2020 Quarter 4 | 2020 October |
Partnumber | Hi6260 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Flagship |
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
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