HiSilicon Kirin 710A vs HiSilicon Kirin 9000 5G
The HiSilicon Kirin 710A and Kirin 9000 5G are two processors that belong to the same brand. However, they possess different specifications that set them apart from each other.
Starting with the Kirin 710A, it features an architecture consisting of 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. With a total of 8 cores, it offers a powerful processing performance. The Kirin 710A operates on ARMv8-A instruction set and has a fabrication lithography of 14 nm. It houses 5500 million transistors and requires a thermal design power (TDP) of 5 Watt.
On the other hand, the Kirin 9000 5G boasts a more advanced architecture. It combines 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. Similar to the Kirin 710A, it also has 8 cores; however, the Kirin 9000 5G operates on ARMv8.2-A instruction set, providing an enhanced performance. It utilizes a 5 nm lithography, resulting in greater energy efficiency. With an impressive 15300 million transistors, this processor offers a substantial increase in processing power. The TDP for the Kirin 9000 5G is slightly higher at 6 Watt. Additionally, it incorporates Neural Processing with Ascend Lite (2x) and Ascend Tiny (1x) as well as HUAWEI Da Vinci Architecture 2.0, contributing to its AI capabilities.
Comparing the two processors, it is evident that the Kirin 9000 5G outshines the Kirin 710A in terms of specifications. It features a more advanced architecture, a smaller fabrication lithography, and a higher number of transistors, indicating improved performance and energy efficiency. Additionally, the inclusion of advanced AI capabilities further enhances its overall processing capabilities.
In conclusion, while the Kirin 710A remains a capable processor, the Kirin 9000 5G stands as the superior choice due to its more advanced specifications and enhanced features.
Starting with the Kirin 710A, it features an architecture consisting of 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. With a total of 8 cores, it offers a powerful processing performance. The Kirin 710A operates on ARMv8-A instruction set and has a fabrication lithography of 14 nm. It houses 5500 million transistors and requires a thermal design power (TDP) of 5 Watt.
On the other hand, the Kirin 9000 5G boasts a more advanced architecture. It combines 1x 3.13 GHz Cortex-A77 core, 3x 2.54 GHz Cortex-A77 cores, and 4x 2.05 GHz Cortex-A55 cores. Similar to the Kirin 710A, it also has 8 cores; however, the Kirin 9000 5G operates on ARMv8.2-A instruction set, providing an enhanced performance. It utilizes a 5 nm lithography, resulting in greater energy efficiency. With an impressive 15300 million transistors, this processor offers a substantial increase in processing power. The TDP for the Kirin 9000 5G is slightly higher at 6 Watt. Additionally, it incorporates Neural Processing with Ascend Lite (2x) and Ascend Tiny (1x) as well as HUAWEI Da Vinci Architecture 2.0, contributing to its AI capabilities.
Comparing the two processors, it is evident that the Kirin 9000 5G outshines the Kirin 710A in terms of specifications. It features a more advanced architecture, a smaller fabrication lithography, and a higher number of transistors, indicating improved performance and energy efficiency. Additionally, the inclusion of advanced AI capabilities further enhances its overall processing capabilities.
In conclusion, while the Kirin 710A remains a capable processor, the Kirin 9000 5G stands as the superior choice due to its more advanced specifications and enhanced features.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.0 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
1x 3.13 GHz – Cortex-A77 3x 2.54 GHz – Cortex-A77 4x 2.05 GHz – Cortex-A55 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8.2-A |
Lithography | 14 nm | 5 nm |
Number of transistors | 5500 million | 15300 million |
TDP | 5 Watt | 6 Watt |
Neural Processing | Ascend Lite (2x) + Ascend Tiny (1x), HUAWEI Da Vinci Architecture 2.0 |
Memory (RAM)
Max amount | up to 6 GB | up to 16 GB |
Memory type | LPDDR4 | LPDDR5 |
Memory frequency | 1866 MHz | 2750 MHz |
Memory-bus | 2x32 bit | 4x16 bit |
Storage
Storage specification | UFS 2.1 | UFS 3.1 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G78 MP24 |
GPU Architecture | Mali Bifrost | Mali Valhall |
GPU frequency | 1000 MHz | 760 MHz |
Execution units | 4 | 24 |
Shaders | 64 | 384 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.1 |
OpenGL API | ES 3.2 | |
Vulkan API | 1.0 | 1.2 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 3840x2160 |
Max camera resolution | 1x 48MP, 2x 24MP | |
Max Video Capture | 4K@30fps | 4K@60fps |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 4.6 Gbps |
Peak Upload Speed | 0.15 Gbps | 2.5 Gbps |
Wi-Fi | 4 (802.11n) | 6 (802.11ax) |
Bluetooth | 5.1 | 5.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS Galileo GLONASS NavIC |
Supplemental Information
Launch Date | 2020 Quarter 4 | 2020 October |
Partnumber | Hi6260 | |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Flagship |
Popular comparisons:
1
Qualcomm Snapdragon 4 Gen 1 vs MediaTek Helio G90T
2
HiSilicon Kirin 950 vs Qualcomm Snapdragon 801
3
MediaTek Helio P22 vs Qualcomm Snapdragon 7s Gen 4
4
Samsung Exynos 1280 vs Samsung Exynos 7420
5
HiSilicon Kirin 955 vs Unisoc T8300
6
Samsung Exynos 1480 vs Qualcomm Snapdragon 750G
7
MediaTek Dimensity 1200 vs Qualcomm Snapdragon 855 Plus
8
Samsung Exynos 7884B vs Unisoc Tiger T610
9
MediaTek Dimensity 7020 vs Qualcomm Snapdragon 675
10
Qualcomm Snapdragon 678 vs MediaTek Helio P90