HiSilicon Kirin 710A vs HiSilicon Kirin 710F
The HiSilicon Kirin 710F and Kirin 710A are two processors manufactured by HiSilicon, offering different specifications and capabilities.
Starting with the HiSilicon Kirin 710F, it features a CPU architecture that includes 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. With a total of 8 cores, it provides efficient multitasking capabilities. The instruction set supported by this processor is ARMv8-A, allowing for advanced instruction execution. In terms of lithography, the Kirin 710F is built on a 12 nm process, which ensures good power efficiency and performance. It contains approximately 5500 million transistors, indicating a decent level of complexity. Its thermal design power (TDP) is rated at 5 Watts, meaning it consumes low power during operation.
On the other hand, the HiSilicon Kirin 710A also has a similar CPU architecture, offering 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. With the same number of cores as the Kirin 710F, multitasking abilities remain unaffected. It also supports the ARMv8-A instruction set, ensuring compatibility with a wide range of applications. However, it has a slightly different lithography process, being built on a 14 nm technology. While it is slightly less power-efficient compared to the Kirin 710F, it still maintains a TDP of 5 Watts. Similarly, it contains around 5500 million transistors, showcasing comparable complexity.
In summary, the HiSilicon Kirin 710F and Kirin 710A processors share many similarities, including the number of cores, instruction set, and TDP. However, they differ in terms of CPU clock speeds and lithography. The Kirin 710F offers higher clock speeds at 2.2 GHz, potentially delivering better performance in demanding tasks. Meanwhile, the Kirin 710A operates at 2.0 GHz but compensates for it with a smaller lithography process at 14 nm, which can enhance power efficiency. Ultimately, the choice between these two processors may depend on the specific requirements and priorities of the user.
Starting with the HiSilicon Kirin 710F, it features a CPU architecture that includes 4x 2.2 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. With a total of 8 cores, it provides efficient multitasking capabilities. The instruction set supported by this processor is ARMv8-A, allowing for advanced instruction execution. In terms of lithography, the Kirin 710F is built on a 12 nm process, which ensures good power efficiency and performance. It contains approximately 5500 million transistors, indicating a decent level of complexity. Its thermal design power (TDP) is rated at 5 Watts, meaning it consumes low power during operation.
On the other hand, the HiSilicon Kirin 710A also has a similar CPU architecture, offering 4x 2.0 GHz Cortex-A73 cores and 4x 1.7 GHz Cortex-A53 cores. With the same number of cores as the Kirin 710F, multitasking abilities remain unaffected. It also supports the ARMv8-A instruction set, ensuring compatibility with a wide range of applications. However, it has a slightly different lithography process, being built on a 14 nm technology. While it is slightly less power-efficient compared to the Kirin 710F, it still maintains a TDP of 5 Watts. Similarly, it contains around 5500 million transistors, showcasing comparable complexity.
In summary, the HiSilicon Kirin 710F and Kirin 710A processors share many similarities, including the number of cores, instruction set, and TDP. However, they differ in terms of CPU clock speeds and lithography. The Kirin 710F offers higher clock speeds at 2.2 GHz, potentially delivering better performance in demanding tasks. Meanwhile, the Kirin 710A operates at 2.0 GHz but compensates for it with a smaller lithography process at 14 nm, which can enhance power efficiency. Ultimately, the choice between these two processors may depend on the specific requirements and priorities of the user.
AnTuTu 10
Total Score
GeekBench 6 Single-Core
Score
GeekBench 6 Multi-Core
Score
CPU cores and architecture
Architecture | 4x 2.0 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
4x 2.2 GHz – Cortex-A73 4x 1.7 GHz – Cortex-A53 |
Number of cores | 8 | 8 |
Instruction Set | ARMv8-A | ARMv8-A |
Lithography | 14 nm | 12 nm |
Number of transistors | 5500 million | 5500 million |
TDP | 5 Watt | 5 Watt |
Memory (RAM)
Max amount | up to 6 GB | up to 6 GB |
Memory type | LPDDR4 | LPDDR4 |
Memory frequency | 1866 MHz | 1866 MHz |
Memory-bus | 2x32 bit | 2x32 bit |
Storage
Storage specification | UFS 2.1 | UFS 2.1 |
Graphics
GPU name | Mali-G51 MP4 | Mali-G51 MP4 |
GPU Architecture | Bifrost | Bifrost |
GPU frequency | 650 MHz | 650 MHz |
GPU boost frequency | 1000 MHz | 1000 MHz |
Execution units | 4 | 4 |
Shaders | 64 | 64 |
DirectX | 12 | 12 |
OpenCL API | 2.0 | 2.0 |
Vulkan API | 1.0 | 1.0 |
Camera, Video, Display
Max screen resolution | 2340x1080 | 2340x1080 |
Max camera resolution | 1x 48MP, 2x 24MP | 1x 48MP, 2x 24MP |
Max Video Capture | 4K@30fps | |
Video codec support | H.264 (AVC) H.265 (HEVC) VP8 VP9 |
H.264 (AVC) H.265 (HEVC) VP8 VP9 |
Wireless
4G network | Yes | Yes |
5G network | Yes | Yes |
Peak Download Speed | 0.6 Gbps | 0.6 Gbps |
Peak Upload Speed | 0.15 Gbps | 0.15 Gbps |
Wi-Fi | 4 (802.11n) | 4 (802.11n) |
Bluetooth | 5.1 | 4.2 |
Satellite navigation | BeiDou GPS GLONASS |
BeiDou GPS GLONASS |
Supplemental Information
Launch Date | 2020 Quarter 4 | 2019 Quarter 1 |
Partnumber | Hi6260 | Hi6260 |
Vertical Segment | Mobiles | Mobiles |
Positioning | Mid-end | Mid-end |
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